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Thermosetting resin composition and prepreg and laminate for printed circuits thereby

A technology of resin composition and prepreg, which is applied in the direction of circuit substrate materials, printed circuit components, layered products, etc., and can solve the problems of large dielectric loss factor, limited dielectric performance and heat and humidity resistance, and insufficient high-frequency characteristics, etc. question

Inactive Publication Date: 2010-02-10
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric loss factor at high frequencies is too large, and the high-frequency characteristics are not sufficient
[0009] In addition, in the above technical scheme, styrene-maleic anhydride and its derivatives are used as the curing agent to improve the epoxy resin composition, so that the epoxy resin, which is the main component in the system, has more options for curing agents. Small, which also limits the modification in improving the dielectric properties and heat and humidity resistance

Method used

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  • Thermosetting resin composition and prepreg and laminate for printed circuits thereby
  • Thermosetting resin composition and prepreg and laminate for printed circuits thereby
  • Thermosetting resin composition and prepreg and laminate for printed circuits thereby

Examples

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specific Embodiment approach

[0083] The following examples illustrate various embodiments of the invention. However, these examples do not limit the invention in any way. The specific implementation method is as follows.

Synthetic example 1

[0085] Mix p-hydroxystyrene / styrene copolymer, epichlorohydrin and dioxane, and feed the p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:5. Dioxane has a p-hydroxystyrene / styrene copolymer weight ratio of 1.89. p-Hydroxystyrene / styrene copolymer synthesized by known method, Wn is 4300. Above-mentioned mixture is heated under nitrogen protection, and heating temperature is at 80 degree, and constantly stirs, and dropwise adds sodium hydroxide solution simultaneously, the concentration of used sodium hydroxide solution is 25wt%, sodium hydroxide and p-hydroxystyrene / styrene copolymer The molar ratio of the lye is 2 / 1, and the lye is added dropwise within 3 hours. During the reaction process, the moisture and epichlorohydrin in the system are continuously separated from the system by azeotropic, and the stratified epichlorohydrin returns to the system. Excess epichlorohydrin and dioxane were distilled off under reduced pressure, methyl isobutyl keton...

Synthetic example 2

[0087] Mix p-hydroxystyrene / styrene copolymer, epichlorohydrin and toluene, and feed the p-hydroxystyrene / styrene copolymer and epichlorohydrin at a molar ratio of 1:10. Dioxane has a p-hydroxystyrene / styrene copolymer weight ratio of 1.89. p-Hydroxystyrene / styrene copolymer synthesized by known method, Wn is 30000. Above-mentioned mixture is heated under the protection of nitrogen, heating temperature is at 100 degree, and constantly stirs, dropwise adds sodium hydroxide solution simultaneously, the concentration of used sodium hydroxide solution is 25wt%, sodium hydroxide and p-hydroxystyrene / styrene copolymer The molar ratio of the lye is 2 / 1, and the lye is added dropwise within 2 hours. During the reaction, the moisture and epichlorohydrin in the system are continuously separated from the system by azeotropy, and the stratified epichlorohydrin returns to the system. Excess epichlorohydrin and toluene were distilled off under reduced pressure, methyl isobutyl ketone was a...

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Abstract

The invention relates to a thermosetting resin composition and a prepreg and a laminate for printed circuits thereby. The thermosetting resin composition comprises at least an epoxy resin with a component being the structural formula (I) and a curing agent. The molecular structure of the epoxy resin composition of the invention contains the low-polarity styrene structure, therefore, the dielectricproperty of the resin is optimized. The dielectric constant and the dielectric loss angle tangent are reduced compared with those of the common epoxy resins. The prepreg obtained by coating the resincomposition on the substrates and the laminate manufactured by laminating the prepreg simultaneously have the characteristics of low dielectric constant, low dielectric dissipation factors, good heatresistance, good dip soldering resistance, good moisture resistance, good humidity resistance and good cohesiveness with copper foils. The resin composition of the invention can be also used for manufacturing the resin sheets, resin composition copper foils, the laminate and the printed circuit boards. R is (a), and n and m are natural numbers.

Description

technical field [0001] The invention relates to a resin composition, in particular to a thermosetting resin composition and a prepreg and a laminated board for printed circuits made of the thermosetting resin composition. Background technique [0002] Among conventional printed circuit board materials, epoxy resins excellent in adhesive properties are widely used. Epoxy resin generally refers to molecules containing two or more epoxy groups, with organic compounds such as aliphatic, alicyclic or aromatic as the skeleton, and can be cured by appropriate chemical reagents (curing) through epoxy groups. A general term for compounds that react to form a three-dimensional network cured product in the presence of an agent). It is one of the most important varieties of thermosetting polymer materials. Epoxy resins are widely used in adhesives, coatings, laminates, molding materials, casting materials, printed circuit boards due to their good chemical stability, electrical insulat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08J5/24B32B15/092B32B15/20H05K1/03
Inventor 苏民社陈勇杨中强
Owner GUANGDONG SHENGYI SCI TECH
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