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Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module

A technology for electronic components and circuit substrates, which is applied to printed circuit components, laminated printed circuit boards, semiconductor/solid-state device components, etc., and can solve problems such as difficulty in achieving high heat dissipation, difficulty in ensuring thickness, and increased development costs , to achieve the effect of light weight, improved degree of freedom, and high degree of freedom

Inactive Publication Date: 2010-01-20
TOYO TANSO KK +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] In this document, it is disclosed that a high-molecular material such as polyimide is pasted on the bottom surface of the substrate, but it is difficult to achieve high heat dissipation due to the structure of heat dissipation through the printed circuit board.
[0014] Moreover, there is also the following problem: the plate after high-temperature treatment of polymer materials such as poly(imide) is restricted by the production method of carbonizing materials such as polyimide, so the degree of freedom of forming is limited. Low (only thin parts can be made), it is difficult to ensure the thickness necessary for high heat dissipation effect, and the cost is high
However, there is a problem that if the volume of the heat dissipation member increases or decreases, it is necessary to redesign the arrangement of parts in the housing, which causes an increase in development cost or a delay in development.

Method used

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  • Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
  • Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
  • Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] In Example 1, in the heat dissipation structure capable of efficiently dissipating the heat generated by the LED module, the heat dissipation effect of the heat dissipation member using different materials was confirmed.

[0098] Generally, the maximum temperature that an LED can use is determined by the surface temperature of the LED chip (junction temperature: Tj), but the Tj temperature cannot actually be measured directly.

[0099] Here, the LED has a characteristic that the forward voltage (Vf) decreases when the junction temperature increases. Therefore, the tendency to change the junction temperature is measured by measuring the forward voltage (Vf).

[0100] The junction temperature can be calculated from the characteristics of the LED voltage and the junction temperature obtained by the preliminary test. The junction temperature can be calculated from this result with constant accuracy.

[0101] The LED module 1 used in this embodiment is composed of a base s...

Embodiment 2

[0119] In this example, a temperature comparison test of graphite sheets with different areas was carried out. like Figure 8 As shown, in this embodiment, seven LED modules 1 used in Embodiment 1 are mounted on the substrate 4 . Silicon grease (G-747) was applied between the heat dissipation member 5 and the LED module 1 . By applying the silicone grease, the contact area can be increased, so that a higher heat dissipation effect can be achieved. The specifications of the heat dissipation member 5 are as follows, and the other structure thereof is the same as that of the first embodiment. Therefore, the bulk density of the graphite flakes is all 2.0Mg / m 3 , Thickness D is 1.5mm.

[0120] "Specifications of Heat Dissipating Components"

[0121] Manufacturer name: Toyo Carbon Co., Ltd.

[0122] Model: PF-150UHP

[0123] Thickness: 1.5mm

[0124] shape etc:

experiment example 1

[0125] Experimental example 1 (with an area of ​​430cm 2 The square of , in addition, has a mass of 129g, so the heat capacity is 45.15J / K)

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Abstract

Intended is to provide a circuit board using a radiating member, which can cool electronic parts sufficiently without breaking the board, increasing the total weight of the board, inviting the decrease in the productivity or the increase in the cost, or enlarging the size. The circuit board is constituted to include a board body (4) having a wiring pattern (3) formed on its surface, and to have an LED module (1) connected with the wiring pattern (3). The circuit board is characterized in that the board body (4) has a through hole (6) formed in its portion to extend from the surface to the back and a radiating member (5) arranged on its back to close one end of the through hole (6), and in that the LED module (1) is so arranged in the through hole (6) that the radiating member (5) and the LED module (1) abut directly against each other.

Description

technical field [0001] The present invention relates to a heat-dissipating member, a circuit board having a heat-dissipating structure utilizing the same, an electronic component module, and a method for manufacturing the same, and more particularly, to a heat-dissipating member composed of a raw material that can be manufactured by changing a heat capacity, and having a space for utilizing the heat-dissipating member A circuit board with a heat dissipation structure capable of adjusting the heat dissipation capability, an electronic component module, and a manufacturing method thereof, which are excellent in performance, light weight, and low cost. Background technique [0002] Conventionally, as a heat dissipation structure of a circuit board, it is widely known that metal wiring is provided on one side of the board, electronic components are mounted on the wiring, and a heat sink such as copper or aluminum is connected to the back surface of the board. face contact. Howe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L23/12H05K1/02
CPCH05K1/021H01L2924/15153H05K2201/0323H05K2201/10106H05K3/0058H01L33/641H01L2924/12041H05K1/182H01L2224/48091H01L2924/01012H01L2924/01004H01L23/373H01L23/13H01L2924/1517H01L2924/01019H01L2224/48227H01L24/48H01L2224/451H01L2924/00014Y10T29/4913H01L2924/00H01L2224/45099H01L2924/00012H01L23/12H05K1/02
Inventor 广濑芳明幸哲也三崎幸典荒川真辉
Owner TOYO TANSO KK
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