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Composition for forming cured film pattern, and method for producing cured film pattern by using the same

A technology of composition and compound, which is applied in the direction of photographic plate-making process of patterned surface, semiconductor/solid-state device manufacturing, and photosensitive material used in optomechanical equipment, etc. Achieves excellent storage stability, excellent resistance to electroless gold plating, and long service life

Active Publication Date: 2009-12-23
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these compounds have poor stability to highly polar solvents, and do not have the mechanical strength to withstand the grinding process, etc., so there are many restrictions on using them to form compositions
Therefore, epoxy-based compositions containing these compounds have few practical examples at present

Method used

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  • Composition for forming cured film pattern, and method for producing cured film pattern by using the same
  • Composition for forming cured film pattern, and method for producing cured film pattern by using the same
  • Composition for forming cured film pattern, and method for producing cured film pattern by using the same

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Embodiment

[0067] Hereinafter, although an Example etc. are shown and this invention is demonstrated more concretely, this invention is not limited to these Examples. In addition, unless otherwise specified below, "part" means a mass part.

Synthetic example

[0069] In a flask equipped with a thermometer, a stirrer, a dropping funnel, and a reflux cooler, measure 210 parts of cresol novolak-type epoxy resin (EPICLON (registered trademark) N-680, manufactured by Dainippon Ink Chemical Industry Co., Ltd., Epoxy equivalent=210) and 96.4 parts of carbitol acetate, heated to dissolve. Next, add 0.1 part of hydroquinone as a polymerization inhibitor, and 2.0 parts of triphenylphosphine as a reaction catalyst. Heat the mixture to 95-105°C, slowly drop in 72 parts of acrylic acid until the acid value reaches below 3.0 mgKOH / g, and react for about 16 hours. Cool the reaction product to 80-90°C, add 76.1 parts of tetrahydrophthalic anhydride, and react for about 6 hours until there is no anhydride absorption peak (1780cm -1 ). 96.4 parts of aromatic solvents (manufactured by Idemitsu Petrochemical Co., Ltd., trade name IPSOL#150) were added to this reaction liquid, and it extracted after diluting. The thus obtained resin varnish having tw...

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Abstract

A composition for forming a cured film pattern comprises a combination of: an alkaline developable photocurable and thermosetting composition containing no thermal curing catalyst; and a developing solution comprising an aqueous solution of a basic curing catalyst of a nitrogen-containing heterocyclic compound for promoting a thermosetting reaction so that it has a long pot-life (useful life) after mixing of a main agent and a hardener or has excellent storage stability as a one-package composition. Preferably, the basic curing catalyst is a heterocyclic compound having an amidine structure. A film of the photocurable and thermosetting composition is selectively exposed to an actinic energy ray and then developed with the developing solution to remove an unexposed area of the film. At this time, the basic curing catalyst penetrates into the photocured film to effect doping. As a result, the film becomes excellent in thermosetting properties besides the patterning properties by development.

Description

technical field [0001] The present invention relates to a composition for forming a cured film pattern and a method for producing a cured film pattern using the same. The pot life (potlife) (useable time) after the main ingredient of the photocurable thermosetting composition used in the photocurable composition and the curing agent is mixed, or it can be made into a composition with excellent storage stability as a liquid, and the combination It can form a cured film pattern with excellent adhesion to various substrates, heat resistance, moisture resistance, chemical resistance, chemical gold plating resistance, electrical insulation, flexibility and other characteristics. Background technique [0002] At present, a combination of light-curing and heat-curing (Dual Cure) compositions represented by solder resists used as permanent protective films for printed circuit boards is widely used in applications requiring high density, high resolution, and high reliability. field ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/32G03F7/004G03F7/027G03F7/40
CPCG03F7/40G03F7/027H05K3/287H05K3/0023G03F7/322H05K2203/124G03F7/0045G03F7/0047H01L21/027H01L21/0271
Inventor 角谷武德宫部英和
Owner TAIYO HLDG CO LTD
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