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Through hole conductive film, preparation method thereof and application

A conductive film and film technology, which is applied in cable/conductor manufacturing, chemical instruments and methods, conductive layers on insulating carriers, etc., can solve the problem of low processing qualification rate of the original conductive cloth, unstable production and operation, and difficult operation control. and other problems, to achieve the effect of good vertical conduction and shielding efficiency, high qualified rate of finished products, and high qualified rate of products

Inactive Publication Date: 2009-10-28
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the electromagnetic shielding conductive cloth on the market is widely used in the field of software shielding due to its excellent vertical conduction and shielding effectiveness. It is mainly used as conductive tape, conductive foam, shielding room, etc. The disadvantage is the original cloth processing pass rate of the conductive cloth. Low, the thickness is difficult to make thin, and the raw material itself is unstable during the processing of conductive fabric products, resulting in unstable production operation, difficult operation control, low product qualification rate, resulting in high costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] On the surface of a polypropylene monolayer with a length of 200 meters, a width of 1080mm, and a thickness of 3 microns, the surface is pretreated with plasma, and the surface dyne value is 55, and then the treated polypropylene film is mechanically punched with circular holes. The surface after drilling is vacuum magnetron sputtering nickel plating, the vacuum degree is 2.5×10 -2 Pa, polypropylene moving speed 1.5m / min, current 5A, voltage: 400V, magnetron sputtering nickel coating thickness 0.005μm, and finally electroplating copper functional coating 1μm on the magnetron nickel coating, thus producing through The conductive film product with a pore size of 5000μm can be used for conductive tape and foam. At this time, the surface and vertical resistance of the material is 0.003Ω / sq;

Embodiment 2

[0039] On the surface of a polypropylene monolayer with a length of 400 meters, a width of 1060mm, and a thickness of 70 microns, the surface is pre-treated with plasma, and the surface dyne value is 63. Then, the treated polypropylene film is laser drilled with diamond-shaped holes and ion-plated. Nickel, Argon Pressure: 4.3×10 -1 Pa, the hollow cathode plasma electron beam power is 5.1KW, and the substrate DC voltage is 2KV on the nickel film material; the thickness of the magnetron sputtering nickel coating is 0.05μm, and finally the functional copper is electroplated on the vacuum magnetron sputtering coating. The coating layer is 1.5 μm, so that a conductive film product with a through-hole diameter of 3000 μm can be produced, which can be used for flame-retardant and heat-resistant shielding materials. At this time, the surface and vertical resistance of the material are 1000Ω / sq.

Embodiment 3

[0041] On the polypropylene multilayer surface with a length of 400 meters, a width of 1080 mm and a thickness of 1000 microns, the surface is pre-treated with plasma, and the surface dyne value is 70, and then the treated polypropylene film is mechanically punched with oval holes. The surface after drilling is vacuum magnetron sputtering nickel plating, the vacuum degree is 2.5×10 -2 Pa, the moving speed of polypropylene is 1.5m / min, the current is 5A, the voltage is 400V, the thickness of the magnetron sputtering nickel coating is 0.5μm, and finally the electroless nickel functional coating is 0.1μm on the magnetron sputtering nickel coating, so that A conductive film product with a through-hole diameter of 1000 μm has been produced, which can be used to shield and sterilize clothing. The surface and vertical resistance of the material at this time was 0.01Ω / sq.

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PUM

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Abstract

The invention provides a through hole conductive film, a preparation method thereof and application. The preparation method of the through hole conductive film comprises the following steps: a, taking a single-layer or multi-layer film of which the thickness is between 3 and 1,000 microns to perform plasma, ion beam or corona treatment so that the surface dyne value is between 39 and 75; b, perforating the film after the treatment; c, performing ion plating, magnetron sputtering plating, vapor deposition and chemical sensitization on the hole wall and at least one surface of the perforated film until a conductive layer of which the thickness is between 0.005 and 0.5 microns is generated; and d, electroplating or chemically plating metal outside the conductive layer until the thickness of the plating layer is between 0.01 and 5 microns, the resistance value is between 0.003 and 10 omega / sq, and the pore diameter of a product is between 1 and 5,000 microns. The surface resistance and the vertical resistance of the through hole conductive film are between 0.005 and 10 omegas, the adhesive force is good, and the screening effectiveness is more than 70 dB; besides, the through hole conductive film is applied to the field of software electromagnetic screen and omnibearing conductive adhesives, and can obtain various functional materials which are heat resistant, inflaming retarding and the like.

Description

Technical field: [0001] The invention relates to the technical field of software shielding, in particular to a through-hole conductive film; at the same time, it also relates to a preparation method of the through-hole conductive film; in addition, it also relates to an application of the through-hole conductive film. Background technique: [0002] At present, the electromagnetic shielding conductive cloth on the market is widely used in the field of software shielding due to its excellent vertical conduction and shielding effectiveness. It is mainly used as conductive tape, conductive foam, shielding room, etc. The disadvantage is the pass rate of the original cloth processing of the conductive cloth. Low, the thickness is difficult to make thin, and the raw material itself is unstable during the processing of conductive fabric products, resulting in unstable production operation, difficult operation control, low product qualification rate, resulting in high costs. Inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14H01B13/00H05K9/00C23C28/00B32B3/24B32B15/04B32B15/08B32B7/02
Inventor 刘世明夏祥华耿秋菊朱焰焰夏登宇
Owner TIANNUO PHOTOELECTRIC MATERIAL
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