Method for manufacturing mask blank and photomask

Abstract

The present invention provides a method for manufacturing mask blank and photomask, comprising the following processes: causing the resists flowing from a liquid tank holding liquid resist to the front opening of a nozzle through a coating nozzle under the action of capillary phenomena to contact with the coated surface of a substrate having films for forming copy patterns, synchronously moving the substrate and the coating nozzle correspondingly, and then coating resists on the coated surface to form a resist film. In the process of forming the resist film, when the coating nozzle reaches nearby the coating ending position of the substrate through the corresponding movement, the coating condition is changed to reduce the coating amount of the coated surface.

Description

technical field [0001] The present invention relates to a method of manufacturing a mask blank and a method of manufacturing a photomask, including the step of forming a resist film using a coating method of coating a coating liquid on a surface to be coated of a substrate by capillary action. Background technique [0002] Conventionally, in pattern formation by photolithography, it is necessary to apply a coating solution such as a photoresist on a substrate to form a resist film. coating machines) known as so-called spin coating machines. This spin coater drips the coating liquid onto the center of the substrate (the surface to be coated) held horizontally, and then rotates the substrate at high speed in the horizontal plane, thereby applying the coating liquid to the entire surface of the substrate under the action of centrifugal force. Spread to form a coating film on the surface of the substrate. [0003] However, in this spin coater, there is a problem that resist bu...

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Problems solved by technology

Furthermore, in the case of using a spin coater, in recent years, liquid crystal display devices or photomasks for liquid crystal display device manufacturing have the following problems: the substrate is in a trend of becoming larger and heavier; Obtain a rotational drive mechanism at a certain speed; a large rotational space (cavity) is required, and the loss of coating liquid is large

[0005] However, even in the case of using the conventional coating method of the CAP coater, the uniformity of the thickness of the resist film formed on the substrate becomes insufficient, especially the peripheral edge of the substrate on the coating end side. problems such as increased film thickness

[0006] If there is a film thickness variation in the in-plane coating film (resist film) of such a substrate, the uniformity of the thickness of the formed resist film will become insufficient, and in-plane variation in CD will occur during pattern formation.

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