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Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method

A technology of pre-preg treatment and flux protection, applied in welding equipment, arc welding equipment, electrical components, etc., can solve problems such as difficult to ensure the appearance of printed circuit boards, limited service life of bath liquid, Giavani effect, etc., and achieve guaranteed shear Cutting strength and reliability of solder joints, service life extension, effect of preventing Giavanni effect

Inactive Publication Date: 2009-08-19
林原标 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technology, the service life of the bath solution is limited, it is not resistant to high temperature packaging process, and it needs to use organic solvents such as alcohols as co-solvents, which is easy to cause Galvanic effect (Galvanic effect) under low pH conditions, and it is difficult to ensure a better printed circuit. board appearance

Method used

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  • Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method
  • Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method
  • Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method

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Embodiment Construction

[0040] The present invention will be further described below through specific embodiments.

[0041] Using the same organic solder preservative (OSP) main solution, its composition is as follows by weight ratio:

[0042] 2-n-Heptylbenzimidazole 5.0%

[0043] Acetic acid 20%

[0044] Caproic acid 0.2%

[0045] Sodium edetate 0.8%

[0046] The pH value of the above organic solder preservative (OSP) main solution was adjusted to 3.3.

[0047] Implementation 1: Take a printed circuit board test piece with two types of soldering pads on the copper surface and the gold surface, and go through the following process of using the organic solder prepreg treatment agent.

[0048] Process Soaking time (sec) Temperature (℃)

[0049] Detergent 120 40

[0050] Washed 60 25

[0051] Microetching 60 25

[0052] Washed 60 25

[0053] Organic flux pre-dip (Pre-dip) 25 25

[0054] Washed 60 25

[0055] Organic Solder Preservative (OSP) Main Solution 60 38

[0056] Washed 60 25

[0057] ...

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Abstract

The invention relates to the technical field of printed circuit board solderability preservation, in particular to an organic solderability preservative preimpregnation finishing agent and an organic solderability preservative forming method. The adopted organic solderability preservative preimpregnation finishing agent comprises the following components in percentage by weight: 0.05 to 6.0 percent of nanometer accelerating agent, 0.01 to 2.0 percent of quinoxaline compound, 0.05 to 2.0 percent of inorganic base, 0.001 to 15.0 percent of ammonia or amine buffering agent, 0.001 to 0.5 percent of metallic salts, and 0.01 to 5.0 percent of halide. The invention firstly forms a nano material active layer on the copper face, and can increase the thickness of the organic solderability preservative by more than 20 percent in the same reaction time, reduce metal pollution speed of tank liquor, double the service life of the tank liquor, prevent galvanic effect, ensure good appearance of a printed circuit board, reduce the thickness of intermetallic compounds (IMC) after soldering, and guarantee the shear strength of welding joints and reliability of welding spots.

Description

technical field [0001] The invention relates to the technical field of soldering protection of printed circuit boards, in particular to an organic soldering protection agent pre-dipping treatment agent and a forming method of an organic soldering protection film. Background technique [0002] Nowadays, printed circuit boards are becoming lighter, thinner and shorter, and the circuits are getting denser, and the assembly of downstream parts often needs to be assembled in more than 3 times, and each assembly needs to go through high-temperature remelting, and some organic solder protection films cannot Resistant to more than 3 times of high temperature remelting, and printed circuit boards have long been troubled by the discoloration of gold fingers, chemical nickel gold pads, and gold plated gold surfaces of substrates after organic solder protection (OSP) treatment, and have been tested The intermetallic compound (IMC) layer produced by solder is brittle, and too thick inter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K9/16C23C22/52H05K3/00
Inventor 林原标钟新兴
Owner 林原标
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