Release film for manufacture of printed wiring plate

A technology for printed circuit boards and release films, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc. It can solve problems such as insufficient tight adhesion of protective films, circuit deformation, and damage to quality, and achieve excellent non-polluting properties , small environmental load, and the effect of improving the qualified rate of products

Inactive Publication Date: 2009-07-22
KURARAY CO LTD
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, fluorine-based films are excellent in heat resistance and mold release. However, they have insufficient adhesion to the protective film, are prone to circuit deformation, are expensive, and are difficult to burn when incinerated during disposal. Toxic Gas Problem
On the other hand, in the silicone-coated polyethylene terephthalate film, and the polymethylpentene film, silicone or low-molecular-weight substances in the constituents migrate, thereby producing a printed circuit board, In particular, pollution of copper wiring is a dangerous problem that impairs quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Release film for manufacture of printed wiring plate
  • Release film for manufacture of printed wiring plate
  • Release film for manufacture of printed wiring plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] The thermoplastic resin layer adopts a 100 μm thick ultra-high molecular weight polyethylene sheet produced by Shin Kogyo Co., Ltd., and the metal layer adopts 50 μm thick aluminum produced by Toyo Alminium Co., Ltd. to form a release film (I).

[0083] In the copolymer of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, the thermoplastic liquid crystal polymer with a melting point of 280°C is melt-extruded, and the longitudinal and transverse stretch ratios are controlled. At the same time, the blown film forming method is used to obtain A thin film with a film thickness of 50 μm and a melting point of 280° C. The obtained film was also placed in a hot air dryer at 260° C. for 3 hours to be heat-treated, whereby a film having a melting point of 290° C. was obtained. This film is used as the main film, and copper foil with a thickness of 18 μm is placed on the upper and lower sides of the main film, and the press temperature is 290 ° C, the press pressure is 4 MPa,...

Embodiment 2

[0088] As the resin layer, instead of the ultra-high molecular weight polyethylene sheet produced by Shin Kogyo Co., Ltd., a 130 μm thick ultra-high molecular weight polyethylene sheet produced by Yodogawa Hitec Co., Ltd. was used to obtain a release film (I). In the same manner as in Example 1, a flexible printed circuit board was obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
melting pointaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

This invention provides a release film for use in pressing working of printed wiring boards, flexible printed wiring boards, multilayer printed wiring plates or other printed wiring plates, for preventing adhesion between a press hot plate and the printed wiring plate or cover lay film. The release film has excellent heat resistance, releasability, noncontamination properties, circuit pattern conformability, and workability in the pressing, and is small in environmental load in waste disposal. The release film comprises at least one thermoplastic resin layer having a modulus of elasticity in shear in the range of 5*10 to 10 Pa at a hot press lamination temperature, and at least one metal layer superimposed on top of each other.

Description

technical field [0001] The present invention relates to a release film that is excellent in heat resistance, mold release, and non-pollution, and is easy to dispose of, and a method for manufacturing a printed circuit board using the release film. Background technique [0002] In the past, in the manufacturing process of printed circuit boards, flexible printed circuit boards, or printed circuit boards such as multilayer printed circuit boards, prepregs or thermoplastic liquid crystals that form an optically anisotropic molten phase When heat-pressing a copper-clad laminate or a copper foil made of a polymer film (hereinafter referred to simply as a thermoplastic liquid crystal polymer film), a release film is used. In addition, in the manufacturing process of the flexible printed circuit board, the protective film formed of the thermoplastic liquid crystal polymer is thermally bonded to the flexible printed circuit board main body forming the circuit by hot pressing through...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08H05K1/03H05K3/28
CPCH05K2201/0141B32B15/08H05K3/281B32B7/06Y10T428/31797H05K1/03H05K3/28
Inventor 九鬼彻小野寺稔浅野诚
Owner KURARAY CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap