System and method for polishing surface of tape-like metal base material
一种金属基材、带状的技术,应用在研磨装置、研磨机床、金属加工设备等方向,能够解决氧化物超传导体临界电流密度低等问题
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0110] Instructions for use figure 1 With the grinding system of the present invention shown, experiments were performed to grind a strip-shaped metal substrate.
[0111] 1. Experimental conditions
[0112] (1) Strip metal substrate: nickel alloy (Ni: 58.0wt%, Cr: 15.5wt%, Fe: 5.0wt%, W: 4.0wt%, also contains Co, etc.) width 10mm, length 100m, thickness 0.1mm
[0113] (2) The first polishing step: a tape body with a width of 150 mm and a thickness of 500 μm formed by foaming polyurethane on a PET film was used as the polishing tape
[0114] Rotational speed of the grinding head (rpm): 30~80 for the first stage, 30~80 for the second stage
[0115] Direction of rotation: 1st stage clockwise, 2nd stage counterclockwise
[0116] Pressure (g / cm 2 ): Level 1 100~500, Level 2 100~500
[0117] Slurry flow rate (ml / min): 5~30 for the first stage, 5~30 for the second stage
[0118] (3) The second grinding process: use non-woven fabric made of polyester fiber as the liner used for ...
PUM
Property | Measurement | Unit |
---|---|---|
width | aaaaa | aaaaa |
length | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com