Continuous thin film vacuum deposition method and apparatus

Abstract

The invention relates to a continuous film vacuum deposition method and a device thereof. The method comprises the steps: an entrance of a vacuum deposition chamber is provided with at least one level of inlet vacuum pre-pump chamber, and an exit of the vacuum deposition chamber is provided with at least one level of outlet vacuum protecting chamber, so that the vacuum degree in the vacuum deposition chamber can be maintained; all levels of inlet vacuum pre-pump chambers, the vacuum deposition chamber and all levels of outlet vacuum protecting chambers are communicated with each other by slits and sealed by valves arranged at the slits; substrates enter all the chambers through the slits; the valves open when the substrates pass through, and close after the substrates pass through; when the substrates enter the inlet vacuum pre-pump chambers or leave the outlet vacuum protecting chamber, at least one inlet valve and outlet valve are close to keep the vacuum degree in the vacuum deposition chamber unchangeable. The transfer speed of the substrates is regulated to lead the distance between two adjacent substrates to be reduced before reaching a deposition device and the distance between two adjacent substrates to be increased when leaving the vacuum deposition chamber, thereby realizing the continuous film deposition and greatly improving the utilization rate of raw materials.

Description

technical field [0001] The invention belongs to the technical field of thin film vacuum deposition, in particular to a continuous thin film vacuum deposition method and device. Background technique [0002] Vacuum thin film deposition is to use vacuum thin film deposition technology to deposit metal, non-metal, semiconductor and other material films with certain functions on the surface of the substrate in a certain vacuum environment. Vacuum thin film deposition technologies currently used include chemical vapor deposition, vacuum evaporation, sputtering, organic metal vapor deposition, epitaxial film vacuum deposition, chemical vapor transfer deposition, sublimation deposition, near-space sublimation deposition, etc. Vacuum-deposited thin films have been widely used in semiconductor, electronics, solar energy, and decoration industries. In order to realize the industrialization of thin film deposition technology, a series of vacuum thin film deposition production lines ha...

AI Technical Summary

Problems solved by technology

Because the slit is too small, the pressure on both sides of the substrate glass sheet will be unbalanced due to the vacuum pump in the pre-pumping chamber, which will cause the glass sheet to vibrate during the transmission process.

Images