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Solder convex point connected metal layer in microelectronic package and use thereof

A technology of microelectronic packaging and metallization layer, which is applied in the field of micro-interconnection, can solve the problems of accelerated reaction rate between metallization layer and solder, lower connection reliability, and consumption of metallization layer, so as to achieve good mechanical reliability and improve use The effects of life, safety and reliability, and stable interface reliability

Inactive Publication Date: 2009-05-06
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under such high temperature conditions, the reaction rate between the metallization layer and the solder will be accelerated, so that the metallization layer will be consumed quickly and lose its proper function.
The thick intermetallic compound layer due to the rapid reaction will also seriously reduce the reliability of the connection
Additionally, severe brittle fractures may occur if the solder joint layer is completely consumed

Method used

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  • Solder convex point connected metal layer in microelectronic package and use thereof
  • Solder convex point connected metal layer in microelectronic package and use thereof
  • Solder convex point connected metal layer in microelectronic package and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] An iron-nickel alloy is electroplated or electrolessly plated on the surface of a conductive substrate such as copper or nickel, or on the surface of a non-conductive substrate covered by a conductive film. The composition and thickness of the electroplated layer can be adjusted according to actual requirements. Such as figure 1 As shown, the plating layer realized by the present invention can be used as the pad metallization layer 7 on the substrate and the printed circuit board 8 and the lower metallization layer 5 of the solder bump 6 in the flip-chip solder connection of the chip 4. Such as figure 2 As shown, the macro cross-sectional view of the iron-nickel plating / tin-silver-copper spherical bump connector.

[0036] A thin iron-nickel layer is plated on the copper substrate by electroplating. Its composition is: iron 57%, nickel 42%, and the rest are unavoidable impurities such as phosphorus (weight percentage). The surface of the plating layer is cleaned with an ac...

Embodiment 2

[0040] The difference from Example 1 is that, in terms of percentage by weight, the composition of the iron-nickel layer is: iron 30%, the balance is nickel and unavoidable impurities, and the unavoidable impurities are below 1% by weight.

Embodiment 3

[0042] The difference from Example 1 is that, in terms of percentage by weight, the composition of the iron-nickel layer is 40% iron, the balance is nickel and unavoidable impurities, and the unavoidable impurities are below 1% by weight.

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Abstract

The invention relates to the micro-interconnecting technology in the field of microelectronic encapsulation, in particular to an iron-nickel coating layer with good weldability taken as a solder ball bump connecting metalizing (transition) layer in the microelectronic encapsulation and the application thereof. The invention can be widely applied to the industry of microelectronic encapsulation, is particularly suitable for the BGA and other types of high-density micro-interconnecting technology, and in particular can be taken as a base plate or a bonding pad metalizing layer on a printing circuit board and a ball bump lower metal layer in the flip chip interconnection, and the like. The invention plates an iron-nickel alloy layer on a copper (or a nickel) layer by adopting the plating method; the weight percentage of iron is 5 to 80 percent; and the thickness of the coating layer and the content of an iron element can be adjusted according to the requirements. The coating layer has good weldability, antioxygenic property and very slow reaction rate in the liquid reaction of a solder ball bump. Under the condition of higher temperature, a very thin and smooth compound layer is generated between the coating layer and a solder; and the connecting interface of the coating layer and the solder ball bump has better mechanic reliability.

Description

Technical field [0001] The present invention relates to micro-interconnection technology in the field of microelectronic packaging, in particular, iron-nickel coating with good solderability as a solder bump connection metallization (transition) layer in microelectronic packaging and its application, and is suitable for general microelectronic connections The technical field of the production of metallized transition layers on substrates and printed circuit board pads and under solder bumps in chip flip-chip interconnection. Background technique [0002] Semiconductor integrated circuit components are called "industrial rice." But in general, what people use is a package with a shell. Electronic packaging has multiple functions such as mechanical support, electrical connection, field shielding, stress relaxation, heat dissipation and moisture prevention. Nowadays, the rapid light, thin, short and miniaturization of electronic equipment has promoted the rapid development of the el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L23/485H01L23/488
CPCH01L2224/16225
Inventor 祝清省郭建军张新房张磊郭敬东尚建库
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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