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Resin composition and heat-resistant adhesive

A resin composition, pressure-sensitive adhesive technology, applied in the direction of ester copolymer adhesives, adhesive types, film/sheet adhesives, etc., can solve difficult peeling, contaminated items, poor reactivity same problem

Active Publication Date: 2009-04-29
OTSUKA CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when a high-temperature treatment process is included in the processing process, there is a problem that the pressure-sensitive adhesive is deteriorated due to the high temperature, firmly fixed to the adherend, and it is difficult to peel off after the process, or even when it can be peeled off, there is a problem. Pressure sensitive adhesives can also adhere to the release side of the item and contaminate the item
However, since the catalyst is easily deactivated by water, oxygen, etc., there are problems such as the need to strictly dehydrate and refine the solvent and monomer used in the polymerization, and the polymerization conditions are strict, requiring ultra-low temperature (-78°C) and Super decompression (10 -8 mmHg), and there is also the problem that the types of monomers that can be applied are limited
However, the reactivity varies greatly depending on the monomer, so it has not yet become a suitable polymerization method for any monomer

Method used

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  • Resin composition and heat-resistant adhesive
  • Resin composition and heat-resistant adhesive
  • Resin composition and heat-resistant adhesive

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0155] Synthesis example 1 (ethyl-2-methyl-2-n-butyl tellurium-propionate)

[0156] Metal tellurium [manufactured by Aldrich, trade name: Tellurium (-40 mesh)] 6.38 g (50 mmol) was suspended in THF 50 ml, and n-butyllithium (manufactured by Aldrich, 1.6 M hexyl) was slowly added dropwise (10 minutes) thereto at room temperature. alkane solution) 34.4ml (55mmol). The reaction solution was stirred until the tellurium metal disappeared completely (20 minutes). To this reaction solution was added 10.7 g (55 mmol) of ethyl-2-bromo-isobutyrate at room temperature, followed by stirring for 2 hours. After the reaction, the solvent was concentrated under reduced pressure, followed by distillation under reduced pressure to obtain 8.98 g of a yellow oily substance (59.5% yield).

[0157] pass 1 H-NMR confirmed ethyl-2-methyl-2-n-butyltellurium-propionate.

[0158] 1 H-NMR (500MHz, CDCl 3 )0.93(t, J=7.5Hz, 3H), 1.25(t, J=7.2Hz, 3H), 1.37(m, 2H), 1.74(s, 6H), 1.76(m, 2H), 2.90(t, J=...

Embodiment 1

[0159] Embodiment 1 (poly-n-butyl acrylate-copoly-polyhydroxyethyl methacrylate)

[0160] In a glove box replaced with argon, 63.8 μL (0.28 mmol) of ethyl-2-methyl-2-n-butyltellurium-propionate produced in Synthesis Example 1, n-butyl acrylate [Tokyo Chemical Co., Ltd. for distillation and purification] 154 mL (1.08 mol), 2-hydroxyethyl methacrylate [Sigma Aldrich Japan Co., Ltd.] 4 mL (32.9 mmol) and 2,2'-Azo 4.6 mg (0.03 mmol) of bis(isobutyronitrile) [manufactured by Otsuka Chemical Co., Ltd., trade name: AIBN] was reacted for 20 hours. According to NMR analysis, the polymerization rate was 94.4%.

[0161] After completion of the reaction, the reactor was taken out from the glove box, dissolved in 500 mL of ethyl acetate, and the polymer solution was passed through a column made of activated alumina (manufactured by Wako Pure Chemical Industries, Ltd.). Ethyl acetate was added to bring the viscosity of the polymer solution to 5000 mPa·S (25°C). The solid content of the o...

Embodiment 2

[0167] To 100 parts by weight of the polymer solution obtained in Example 1 in terms of solid content, 2 parts of Coronet L-55E (same as above) was added as a crosslinking agent in terms of solid content, and stirred to obtain a pressure-sensitive adhesive. combination.

[0168] This was applied on a PET film so that the thickness after drying would be 25 μm, and dried at 105° C. for 2 minutes to prepare an adhesive film.

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Abstract

Disclosed is a resin composition which is characterized in that the metal content in the composition is not more than 1000 ppm. The resin composition contains a copolymer which is obtained by copolymerizing 80-99.9 parts by weight of a vinyl monomer mainly containing a (meth)acrylic acid alkyl ester and 0.1-20 parts by weight of a vinyl monomer having a reactive functional group by living radical polymerization, while using, as a polymerization initiator, one of the following: (a) an organic tellurium compound represented by the formula (1) below; (b) a mixture of an organic tellurium compound represented by the formula (1) below and an azo polymerization initiator; (c) a mixture of an organic tellurium compound represented by the formula (1) below and an organic ditellurium compound represented by the formula (2) below; and (d) a mixture of an organic tellurium compound represented by the formula (1) below, an azo polymerization initiator and an organic ditellurium compound represented by the formula (2) below. (In the formula, R<1> represents a C1-C8 alkyl group, an aryl group, a substituted aryl group or an aromatic heterocyclic group; R<2> and R<3> respectively represent a hydrogen atom or a C1-C8 alkyl group; and R<4> represents an aryl group, a substituted aryl group, an aromatic heterocyclic group, an acyl group, an amide group, an oxycarbonyl group or a cyano group.) (R<1>Te)2 (2) (In the formula, R<1> is as defined above).

Description

technical field [0001] The present invention relates to a resin composition obtained by living radical polymerization using an organotellurium compound, and a pressure-sensitive adhesive using the composition having excellent heat resistance. [0002] Furthermore, the present invention relates to a surface protection film having an adhesive layer excellent in heat resistance and affinity obtained by forming an adhesive layer formed of the above pressure-sensitive adhesive on a substrate. [0003] Furthermore, the present invention relates to an optical film having an adhesive layer excellent in durability obtained by forming an adhesive layer formed of the above pressure-sensitive adhesive on a substrate. Background technique [0004] Copolymers of various combinations of monomers have been used as resin compositions for pressure-sensitive adhesives so far. Compared with polymers produced from a single monomer, they have the characteristics of various monomers. In addition, ...

Claims

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Application Information

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IPC IPC(8): C08F4/04C08F4/42C08F220/00C08L33/06C09J7/02C09J133/06
CPCC08F4/00C08F4/72C08F4/42C09J133/066C08F2438/00C08F293/005C08K5/36C08F4/04C08F20/18C08L33/06
Inventor 河野和浩
Owner OTSUKA CHEM CO LTD
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