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Mold release sheet for hot pressing and method for manufacturing flexible printed wiring board using the same

A flexible printing and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, and printed circuit precursor manufacturing, can solve the problems of reduced connection reliability, discoloration of gold-plated surface, and insufficient mold release, etc. Connection reliability, easy peeling effect

Active Publication Date: 2009-04-29
SOMAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these release sheets have insufficient mold releasability from the flexible printed circuit board after hot pressing, or the circuit surface formed by conductors such as copper and terminal plating are caused by deposits deposited from the sheet during hot pressing. Discoloration of the gold-plated surface reduces connection reliability
In order to solve these problems, a release sheet for printed circuit board lamination formed by coating polysiloxane on at least one surface of a resin film on the surface of a metal plate has been proposed (see Patent Document 6), or by a specific Release sheet made of alicyclic olefinic resin (refer to Patent Document 8), but still cannot meet the requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] 60 wt. Parts, acrylic resin B (glass transition temperature -60°C, weight average molecular weight: 900,000, containing 2-ethylhexyl acrylate and 2-hydroxyethyl methacrylate as constituent monomers) 10 parts by mass, acrylic resin C (glass transition temperature 18°C, weight average molecular weight 400,000, containing methyl methacrylate, ethyl acrylate and 2-hydroxyethyl methacrylate as constituent monomers) 40 parts by mass, isocyanate crosslinking agent (commercial Name: Takene-to D-170N, non-volatile content 20%, manufactured by Mitsui Chemicals Polyurethane Co., Ltd., etc.) 5 parts by mass, antioxidant (trade name: Adekastab AO-330, non-volatile content 10%, Rising Sun 2 parts by mass of Kagaku Kogyo Co., Ltd., 2 parts by mass of di-n-butyltin laurate (1% non-volatile content, manufactured by Wako Pure Chemical Industries, Ltd.), and 300 parts by mass of methyl ethyl ketone were uniformly mixed and dissolved , to prepare a resin-forming coating solution. Using a...

Embodiment 2

[0069] Except having adjusted the acrylic resin B to 2 mass parts, it carried out exactly the same as Example 1, and prepared the release sheet for hot-pressing. Table 1 shows the measurement results of the physical property values ​​and the evaluation results of various properties of the release sheet for hot pressing.

Embodiment 3

[0071] Except change to: acrylic resin C30 parts by mass, acrylic resin D (glass transition temperature -42°C, weight average molecular weight 400,000, 2-ethylhexyl acrylate, 2-hydroxyethyl methacrylate ester and vinyl acetate) 70 parts by mass, and 15 parts by mass of the crosslinking agent used in Example 1, a release sheet for hot pressing was prepared in exactly the same manner as in Example 1. Table 1 shows the measurement results of the physical property values ​​and the evaluation results of various properties of the release sheet for hot pressing.

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Abstract

A mold release sheet for hot pressing which comprises a film made of a heat-resistant plastic, and a resin layer having a glass transition temperature (Tg) of -50 to 20 DEG C and exhibiting good mold release property which is provided on at least one surface of the film. The sheet can be easily released from a film-adhered article without giving an damage to a substrate after hot pressing, causing the contamination such as adhesion of a resin, etc., and furthermore, without causing the lowering of the connection reliability due to discoloration of a gold-plated surface formed by the terminal plating.

Description

technical field [0001] The present invention relates to a release sheet, and in particular, to a release sheet which is arranged between a workpiece and a hot plate to uniformly apply heat and pressure to the workpiece during hot press processing, and to a method using the same A method of manufacturing a flexible printed circuit board. Background technique [0002] Conventionally, reinforcement materials, decorations, etc. have been pasted on the surface of articles for reinforcement and decoration. For example, in order to protect the IC surface of an IC card, sticking a transparent protective film, a manufacturing process of a flexible printed wiring board, etc. are mentioned. These processes are mainly performed by hot pressing, especially when an adhesive made of a thermosetting resin is used for pasting, and hot pressing is performed at a high temperature such as 180° C. or higher. In addition, hot pressing is also performed not only at the time of pasting, but also ...

Claims

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Application Information

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IPC IPC(8): B29C43/02B32B27/30B32B27/00H05K3/00
CPCH05K1/0393H05K3/022B29C33/68B29C43/18B29C43/02B32B27/00B32B27/30H05K3/00
Inventor 中山真纪叶多渚福原邦昭佐藤孝
Owner SOMAR CORP
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