Method for self-judgment of measurement data reliability of self-adapting focusing and leveling sensor system

Abstract

The invention discloses a self-adaptive focusing and leveling sensor system and the application method thereof. The system is characterized in that a light spot mask is further provided with a light through hole of predictive light spots formed outside an exposure slit; the predictive light spot formed outside the exposure slit is adopted to realize self-adaptation of the self-adaptive focusing and leveling system to the process, carry out self judgment on the credibility of the measurement data of the self measurement point, and perform feedback control on the light intensity or gain link. The system has the beneficial effects of greatly improving the availability, production efficiency and yield of the focusing and leveling system, reducing the processing experiment workload, lowering the use cost, improving the measurement performance of focusing and leveling and working performance of a workpiece table, and finally improving the working performance of the whole lithography machine, and lowering the use cost and the use difficulty thereof.

Description

[0001] The present invention is a divisional application of the application number CN200610118480.7 "Adaptive Focusing and Leveling Sensor System and Application Method", and the filing date of the original application was November 17, 2006. technical field [0002] The invention belongs to the field of focusing and leveling sensors of projection lithography machines, and in particular relates to a method for self-judging the credibility of measurement data by a focusing and leveling sensor system with self-adaptive capability. Background technique [0003] The photolithography machine is an exposure device that transfers the pattern on the mask to the object to be processed (such as silicon wafer, etc.) in a certain proportion. see figure 1 , in the projection lithography machine, the exposure light beam illuminates the mask 18 engraved with the integrated circuit pattern, and the mask 18 is imaged on the silicon wafer 6 of the processing object through the projection objec...

AI Technical Summary

Problems solved by technology

First of all, the customer needs to make a corresponding spot switching table according to the specific characteristics of focusing and leveling, as well as each type of silicon wafer and the different layers of a type of silicon wafer, and needs to input this information into the In the lithography machine, this not only requires a large number of process experiments, but also needs to input a large amount of work definition data content during the work process, which increases the cost and difficulty of using the entire lithography machine, and also reduces the cost of the lithography machine. The production efficiency of the machine; secondly, the use of the spot switching table will also complicate the scanning control and the processing of the focus and leveling data; thirdly, due to the deterioration of the flatness of the photoresist on different silicon wafers or different positions in the same silicon wafer The characteristics such as the degree of degradation and deterioration do not fully follow t

Images