Heat conduction flame-proof liquid silicon rubber for electron and method of producing the same
A liquid silicone rubber and electronic technology, used in rubber insulators, organic insulators, etc., can solve the problems of high vulcanization temperature, power consumption, affecting production environment, etc., and achieve the effects of good storage stability, low energy consumption and high thermal conductivity.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0042] Embodiment 1: A heat-conducting flame-retardant liquid silicone rubber for electronics, its preparation steps are as follows:
[0043]a) Add 10Kg of vinyl-terminated polydimethylsiloxane with a polymerization viscosity of 500-5000mPa.s and 10Kg of vinyl-terminated polydimethylsiloxane with a polymerization viscosity of 10000-50000mPa.s into the kneader at 25°C base siloxane, 2Kg hexamethyldisilazane, 0.5Kg distilled water and 0.01Kg white powder, knead evenly;
[0044] b), mixing 20Kg surface hydrophobic Al 2 o 3 Mix powder with MgO and 10Kg Al(OH) with a particle size of 2μm 3 Powder, Al in mixed powder 2 o 3 MgO and MgO particle sizes are 5 μm and 2 μm respectively, add to the kneader in batches, with an interval of no less than 5 minutes each time, and continue to knead at room temperature for 1 hour after kneading into agglomerates;
[0045] c), heating up to 150°C and kneading at a constant temperature for 1 hour;
[0046] d) Vacuum at 150°C and knead for 2 h...
Embodiment 2
[0048] Embodiment 2: A kind of heat-conducting flame-retardant liquid silicone rubber for electronics, its preparation steps are as follows:
[0049] a) Add 40Kg of vinyl-terminated polydiethylsiloxane with a polymerization viscosity of 500 to 5000mPa.s and 40Kg of vinyl-terminated polypropylene with a polymerization viscosity of 10000 to 50000mPa.s into a kneader at 25°C base siloxane, 5Kg hexamethyldisilazane, 2Kg distilled water and 0.02Kg yellow paste, knead evenly;
[0050] b) Mix 50KgAl 2 o 3 Mixed powder with MgO and 50Kg of Al(OH) with a particle size of 10μm 3 Powder, Al in mixed powder 2 o 3 MgO and MgO particle sizes are 5 μm and 2 μm respectively, add to the kneader in batches, with an interval of no less than 5 minutes each time, and continue to knead at room temperature for 1 hour after kneading into agglomerates;
[0051] c), heating up to 150°C and kneading at a constant temperature for 1 hour;
[0052] d) Vacuum at 150°C and knead for 2 hours at a gauge ...
Embodiment 3
[0054] Embodiment 3: A kind of heat-conducting flame-retardant liquid silicone rubber for electronics, its preparation steps are as follows:
[0055] a) Add 25Kg of vinyl-terminated polydimethylsiloxane with a polymerization viscosity of 500-5000mPa.s and 25Kg of vinyl-terminated polydimethylsiloxane with a polymerization viscosity of 10000-50000mPa.s into the kneader at 25°C base siloxane, 3.5Kg hexamethyldisilazane, 1Kg distilled water and 0.01Kg yellow paste, knead evenly;
[0056] b) Mix 30KgAl 2 o 3 Mix powder with MgO and 25Kg Al(OH) with a particle size of 5μm 3 Powder, Al in mixed powder 2 o 3 MgO and MgO particle sizes are 5 μm and 2 μm respectively, add to the kneader in batches, with an interval of no less than 5 minutes each time, and continue to knead at room temperature for 1 hour after kneading into agglomerates;
[0057] c), heating up to 150°C and kneading at a constant temperature for 1 hour;
[0058] d) Vacuum at 150°C and knead for 2 hours at a gauge ...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
thermal resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com