Method and chip for integrating micro electromechanical system device and integrated circuit

Abstract

The invention provides an integration method and an integrated chip for a micro-electronic-mechanical-system device and an integrated circuit. The method comprises the following steps of: firstly, providing a first chip provided with a first electric connection point and the MEMS device, and a second chip provided with a second electric connection point and the integrated circuit; then, generating a first additional conductive point on the first electric connection point, and simultaneously generating a first package ring surrounding the MEMS device; generating a second additional conductive point on the second electric connection point, and simultaneously generating a second package ring on the second chip; finally, leading the first chip and the second chip in abutting joint, leading the first additional conductive point and the second additional conductive point to be fused in abutting joint to complete the electric connection of the MEMS device and the integrated circuit, simultaneously, leading the first package ring and the second package ring to be fused in abutting joint to package the MEMS device in the ring, thereby reducing the package cost, simultaneously shortening the electric connection route between the MEMS device and the integrated circuit, and effectively reducing stray capacitance and coupling inductance.

Description

technical field [0001] The invention relates to an integration method and an integrated chip of a micro-electromechanical system (MEMS) device and an integrated circuit. Background technique [0002] MEMS technology is a high-tech development in recent years. Compared with corresponding devices made by traditional technology, devices made by MEMS technology have obvious advantages in volume, power consumption, weight and price, and it adopts advanced semiconductor manufacturing technology, which can realize batch manufacturing of MEMS devices. In the market, the main application examples of MEMS devices include pressure sensors, accelerometers and silicon microphones. [0003] MEMS devices need to be connected and integrated with integrated circuits (CMOS / Bipolar) such as drive, detection, and signal processing to become a system with complete independent functions. At present, there are many kinds of integration schemes. The production of circuits and MEMS devices on the ...

AI Technical Summary

Problems solved by technology

The scheme firstly manufactures MEMS devices and integrated circuits separately on different chips, then mounts them adjacently on the same substrate, and electrically connects them through wire bonding, and then conducts ceramic or metal packaging to Complete integration, the disadvantage of this scheme is that the electrical connection between the two is realized by a long lead wire, which will introduce more interference signals, which will lead to a decrease in the overall performance of the system, and the second is that MEMS devices are generally on the order of microns in size Movable parts, these parts are relatively fragile, so plastic packaging cannot be used for packaging integration, but ceramic or metal packaging is required, so the cost of packaging is relatively high, and the packaging cost can be 10 to 100 times higher than the cost of the MEMS device itself

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