Photomask testing method, photomask manufacture method, electronic component manufacture method, testing mask and testing mask set

Abstract

The invention relates to a detection method of a photo mask, a manufacturing method of a photo mask, a manufacturing method of an electronic member, a test mask and a test mask group; wherein, the test mask is used to undergo exposure, development, to acquire test resist pattern to be test to acquire actual exposure test pattern data; in addition, optical irradiation undergoes for the test mask under a specified optical condition to acquire light transmission pattern through imaging equipment, and further acquire light transmission test pattern data based on the same; the actual exposure test pattern data is compared to the light transmission test pattern data so as to set an optical condition based on the result of the compare, to undergo detection of the photo mask based on the light transmission pattern acquired through optical irradiation for the photo mask as the detection object.

Description

technical field [0001] The present invention relates to a photomask inspection method for inspecting the performance of a photomask used in the production of electronic components, a photomask production method including an inspection process based on the inspection method, and a photomask using the The manufacturing method of the electronic component of the photomask obtained by the manufacturing method, and the test mask and the test mask group applicable to the inspection method of the said photomask. [0002] In particular, the present invention relates to the manufacture of photomasks used in the manufacture of display devices represented by flat panel display devices (FPD), especially in the manufacture of liquid crystal display devices, such as in the manufacture of thin film transistors (TFTs), color filters ( CF) The inspection method used for the manufacture of a useful photomask, etc. are manufactured. Background technique [0003] Currently, regarding the inspec...

AI Technical Summary

Problems solved by technology

[0010]However, in this inspection method, sometimes it is difficult to fully reflect the exposure conditions of the exposure device used for actual exposure, that is, the spectral characteristics and resolution of the light source, etc.

In addition, the spectral sensitivity of the resist material used to form the resist film and the spectral sensitivity characteristics of the imaging device (CCD, etc.) used to acquire transmitted light data are caused by factors other than the exposure device, and it is difficult to match the conditions.

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