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Method for preparing flexibility printed circuit board using PET as base material

A flexible printing and manufacturing method technology, applied in printed circuit parts, circuit substrate materials, conductive pattern formation, etc., can solve the problems of low surface energy, limited application, low bonding force between insulating ink and PET film, etc., to achieve enhanced Surface energy and adsorption capacity, the effect of expanding the range of applications

Inactive Publication Date: 2008-11-12
靖江市杰华网络技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Low surface energy is a major feature of high polymer materials. This feature of high polymers makes the printing material (silver paste) and insulating ink and PET film have low binding force during printing operations. Therefore, PET is currently used as the base material. The current flexible printed circuit board can only be made into a flexible printed circuit board with a single layer and a wide line (that is, the bonding area between the conductive pattern and the PET substrate is large), and the application is very limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0028] A first embodiment of the method for manufacturing a flexible printed circuit board with PET as the base material of the present invention, the steps include:

[0029] ① Cut the PET base material into the required size;

[0030] ②Set up positioning holes on the PET substrate;

[0031] ③Treat the surface of the PET substrate with plasma gas: Put the PET substrate into the plasma etching machine, and simultaneously pass CF at 135°F into the cavity of the plasma etching machine at a speed of 300cc / min. 4 and O 2 , The plasma etching machine treats the surface of the PET substrate with 1600W RF power to enhance the surface energy and adsorption capacity of the PET substrate.

[0032] Since plasma gas is a fully or partially ionized gaseous state substance, which contains atomic groups, uncharged molecules, ion metastable states and excited states, and the content of electrons, positive ions and negative ions is approximately equal, the material energy is high, and it is e...

no. 2 example

[0048] A second embodiment of the method for making a flexible printed circuit board with PET as the base material of the present invention, the steps include:

[0049] ① Cut the PET base material into the required size;

[0050] ②Set up positioning holes and via holes on the PET substrate;

[0051] ③Treat the surface of the PET base material with plasma gas: put the PET base material into the plasma etching machine, and simultaneously pass 160°F CF at the speed of 250cc / min into the plasma etching machine cavity. 4 and O 2 , The plasma etching machine treats the surface of the PET substrate with 1200W RF power to enhance the surface energy and adsorption capacity of the PET substrate.

[0052] ④Wash the treated PET base material with water, and then dry it;

[0053] ⑤Print silver paste conductive patterns on the surfaces of both sides of the PET base material, and at the same time of printing, fill the via holes with silver paste, so that the silver paste conductive patter...

no. 3 example

[0058] A third embodiment of the method for manufacturing a flexible printed circuit board with PET as the base material of the present invention, the steps include:

[0059] ① Cut the PET base material into the required size;

[0060] ②Set up positioning holes and via holes on the PET substrate;

[0061] ③Treat the surface of the PET base material with plasma gas: put the PET base material into the plasma etching machine, and simultaneously pass 110°F CF at a speed of 500cc / min into the plasma etching machine cavity 4 and O 2 , The plasma etching machine treats the surface of the PET substrate with 2000W RF power to enhance the surface energy and adsorption capacity of the PET substrate.

[0062] ④Wash the treated PET base material with water, and then dry it;

[0063] ⑤Print silver paste conductive patterns on the surfaces of both sides of the PET substrate, and at the same time of printing, fill the via holes with silver paste, so that the silver paste conductive pattern...

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PUM

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Abstract

The invention relates to a method for manufacturing a flexible printed circuit board adopting PET as base materials. The method comprises following procedures: (1) the PET base material is cut into wanted size; (2) the PET base materials is provided with a locating hole; (3) after treatment, the PET base material is washed with water and dried; (4) the surface of the PET base material is printed with a silver paste conductive pattern; (5) after being printed with silver paste, a semi-finished product is put into an oven to be dried; (6) after being dried, the semi-finished product is printed with insulated ink; (7) and the insulated ink is solidified. The manufacturing method also comprises following procedures between the procedures (2) and (3): plasma gas is used for treating the surface of the PET base material to strengthen the surface energy and the absorptive capacity of the PET base material, which is applicable to the manufacture of multi-layer and / or the narrow-circuit flexible printed circuit board. So the application scope of the flexible printed circuit adopting PET as base materials is enlarged.

Description

technical field [0001] The invention relates to a method for manufacturing a flexible printed circuit board, in particular to a method for manufacturing a flexible printed circuit board with PET as a base material. Background technique [0002] With the development of electronic products in the direction of high density, miniaturization and high reliability, the printed circuit boards supporting electronic products are also gradually developing in the direction of lightness, thinness and flexibility. Among them, the flexible printed circuit board (FPC) has been more and more widely used in electronic products due to its advantages of bending, folding, three-dimensional wiring, and three-dimensional space interconnection, and has replaced the traditional rigid printed circuit board ( PCB). [0003] In the general concept, the circuit board referred to by flexible printed circuit board (FPC) is mainly a circuit board made of PI film as the base material and laminated copper f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K1/03
Inventor 余婷李贤维
Owner 靖江市杰华网络技术有限公司
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