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Minitype metal nickel mould producing method

A production method and technology of metal nickel, applied in the direction of metal material coating process, microstructure technology, microstructure device, etc., can solve the problems of low production efficiency, high production cost, complicated micro-mold production process, etc., and achieve low production cost , high productivity and simple production process

Inactive Publication Date: 2008-06-25
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of complex micro-mold production process, high production cost and low production efficiency, and to provide a production method with low production cost, simple process and suitable for batch production of submicron micro-nickel metal molds.

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  • Minitype metal nickel mould producing method
  • Minitype metal nickel mould producing method
  • Minitype metal nickel mould producing method

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Embodiment Construction

[0040] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0041] Refer to Figure 1 for the technical route of preparing micro-nickel metal molds based on the composite process of ultraviolet nanoimprinting and micro-electroforming, including: ①mastering; ②substrate pretreatment; ③sputtering seed layer; ④UV nanoimprinting; ⑤ Deposition of the seed layer; ⑥ electroplating nickel deposition; ⑦ additional metal backing; ⑧ demoulding.

[0042] 1) Mastering

[0043] Using the electron beam direct writing lithography system, due to its ability to continuously change its exposure dose along with the point exposure scanning path, it is possible to obtain continuously varying exposure depths on the electron photoresist. Utilizing this characteristic, three-dimensional micro-nano structures can be formed on electronic photoresists. Therefore, the master plate containing the mold cavity microstructure was prep...

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Abstract

The invention discloses a method for making a micro metal nickel mold. By adopting ultraviolet nano-imprint lithography and micro electroforming composite technology, the invention comprises the following basic technique flow: (1) a mother blank is lithographed by electron direct lithographing and dry etching; (2) a piece of glass taken as a substrate is cleaned and baked, with surface pretreated; (3) a Cr / Cu electroforming seed layer with a thickness of 90-110nm is sputtered on the glass substrate; (4) by taking the mother blank made by the step (1) as an imprint plate, a mold cavity microstructure is copied on ultraviolet organic light-cured substrate material by using a UV nano-imprint lithography technique; (5) a Cr / Cu or Au / Ti electroforming seed layer with a thickness of 8-12nm is deposited on the substrate material; (6) nickel with a depositional thickness of 300-500Mum is electroformed on the seed layer of the substrate material; (7) a metal backing is added; (8) after knockout, the metal nickel mold is obtained. The method has the advantages of low producing cost, simple technique and high producing effect, and can realize batch fabrication of submicron and nano-micro metal nickel mold with low cost.

Description

technical field [0001] The invention relates to a method for manufacturing a miniature mold, in particular to a method for manufacturing a miniature metal nickel mold with low cost and mass production. Background technique [0002] With the process of MEMS industrialization, the demand for micro-parts in the field of micro-electro-mechanical systems continues to increase and the quality requirements continue to improve. Micro-forming technology will develop rapidly to meet the requirements of micro-parts forming and will become an industry Another emerging high-tech field in the world. Although micro-forming technology has great application potential and development space, the manufacture of micro-molds, which is the core technology of micro-forming technology, is facing more and more severe challenges and has become a bottleneck restricting the rapid development of micro-forming. Micro-molds can be divided into the following types according to different shaped parts: micro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 兰红波
Owner SHANDONG UNIV
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