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Linetype bisphenol F phenolic epoxy resin and preparation method thereof

A phenolic epoxy resin and phenolic resin technology, applied in the field of online bisphenol F phenolic epoxy resin and its preparation, can solve the problems of reduced impact resistance, low heat resistance, large molecular chain rigidity, etc., and improve impact resistance. , The effect of improving heat resistance and high crosslinking density

Inactive Publication Date: 2008-05-14
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Bisphenol A epoxy resin is currently the most widely used general-purpose epoxy resin on the market. It is widely used in many aspects such as coatings, adhesives, engineering plastics and composite materials, and civil engineering materials. However, it has two disadvantages: (1) due to the dual The isopropyl structure in the phenol A molecule restricts the rotation of the chain, thus making the molecular chain more rigid and reducing the impact resistance of the system; (2) bisphenol A epoxy resin is a two-functional molecule, and its curing The cross-linking density of the final product is not high, resulting in low heat resistance
Novolac epoxy resin is a multifunctional epoxy resin produced by epoxidizing novolac as raw material. It has both the high thermal stability of phenolic resin and the high reactivity of epoxy resin. There are more than two epoxy groups in the molecule, so the cured product has a high crosslinking density, excellent heat resistance, strength, modulus, electrical insulation, etc., and is widely used in electronic packaging and copper clad laminates and other electronic industries. However, since the molecular structure is mainly connected by benzene ring rigid groups, the cured product is more brittle

Method used

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  • Linetype bisphenol F phenolic epoxy resin and preparation method thereof
  • Linetype bisphenol F phenolic epoxy resin and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] Components: novolac bisphenol F phenolic resin (softening point: 58° C.): 200 g, epichlorohydrin: 900 g, benzyltrimethylammonium chloride: 3 g, NaOH solution (50%): 164 g, toluene: 470 g.

[0031] Preparation method: Add the raw materials novolac bisphenol F phenolic resin and epichlorohydrin into a 2000ml three-necked flask according to the ratio, start stirring to completely dissolve the novolac bisphenol F phenolic resin, then add benzyltrimethylammonium chloride and stir Evenly, then raise the temperature to 100°C for 2 hours, then control the reaction temperature at 80°C, add 123g NaOH solution dropwise at a constant speed for 2 hours, keep the temperature for 1 hour after the dropwise addition, and then use filter cloth to filter out the salt generated by the reaction , take off epichlorohydrin under reduced pressure, obtain thick linear bisphenol F novolac epoxy resin, then add 150g toluene in the there-necked flask, stir and dissolve thick linear bisphenol F novo...

Embodiment 2

[0038] Components: novolac bisphenol F phenolic resin (softening point 106°C): 200g, epichlorohydrin: 1100g, tetramethylammonium chloride: 1.6g, NaOH solution (50%): 188g, NaOH solution (10% ): 20g, butanone: 400g.

[0039] Preparation method: Add the raw materials novolac bisphenol F phenolic resin and epichlorohydrin into a 2000ml three-necked flask according to the ratio, start stirring to completely dissolve the novolac bisphenol F phenolic resin, then add tetramethylammonium chloride and stir evenly, Then, the temperature was raised to 65° C. for 3 hours, and then, 188g NaOH solution (concentration was 50%) was added dropwise at a constant speed with a constant pressure dropping funnel, while the there-necked flask was controlled to be negative pressure (pressure control with the speed of dropping lye and The same rate of detached liquid shall prevail), add epichlorohydrin every 0.5 hours (the additional amount should be equal to the detached amount), and the dripping tim...

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Abstract

The invention relates to a bisphenol F novolac epoxy resin and the preparation method, which is characterized in that: the composition comprises bisphenol F novolac resin, quaternary ammonium salt, epichlorohydrin, sodium hydroxide, water, toluene or butanone; the quaternary ammonium salt ranges from 0.08g to 3g in every mol phenolic hydroxyl; the epichlorohydrin ranges from 3 to 14mol in every mol phenolic hydroxyl; the sodium hydroxide ranges from 1.1 to 1.5mol in every mol phenolic hydroxyl; the mass of toluene is 1.5 to 3 times that of the bisphenol F novolac resin. The invention has the advantages that the methylene replaced by the isopropyl in the bisphenol; a epoxy resin can eliminate the constraint of the rotation of the chain segment, lower the rigidity of the chain, and improve the impact resistance. In addition, since the invention is polyfunctional molecule, the heat resistance of the resin is improved. Bisphenol F novolac epoxy resin series products from liquid to solid can be obtained through the control of polymerization degree n.

Description

technical field [0001] The invention relates to a novolac bisphenol F novolak epoxy resin and a preparation method thereof. Background technique [0002] Bisphenol A epoxy resin is currently the most widely used general-purpose epoxy resin on the market. It is widely used in many aspects such as coatings, adhesives, engineering plastics and composite materials, and civil engineering materials. However, it has two disadvantages: (1) due to the dual The isopropyl structure in the phenol A molecule limits the rotation of the chain, thus making the molecular chain more rigid, resulting in a reduction in the impact resistance of the system; (2) bisphenol A epoxy resin is a two-functional molecule, and its curing The cross-linking density of the final product is not high, resulting in low heat resistance. Novolak epoxy resin is a multifunctional epoxy resin produced by epoxidizing novolac as raw material. It has both the high thermal stability of phenolic resin and the high react...

Claims

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Application Information

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IPC IPC(8): C08G59/08
Inventor 陈立新景晨丽宋家乐陈伟伟王建宇
Owner NORTHWESTERN POLYTECHNICAL UNIV
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