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Metal removing solution and metal removing method using the same

A metal, palladium alloy technology, applied in the field of metal removal liquid, can solve the problems of copper erosion, precipitation of tin hydroxide, etc.

Inactive Publication Date: 2011-07-20
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is the following problem in these prior art: promptly remove tin and also produce corrosion to copper
The tin remover in Patent Document 13 is a remover containing tin ions, and since it contains tin ions at a high concentration, when the treated material is washed with water, tin hydroxide or the like may be deposited on the surface.

Method used

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  • Metal removing solution and metal removing method using the same
  • Metal removing solution and metal removing method using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～7、 comparative example 1～3

[0055] 1. Palladium removal test

[0056] Manufacturing method of Pd attachment plate

[0057] A substrate made of glass epoxy resin with a thickness of 0.2 mm, a length of 10 cm, and a width of 10 cm was processed as follows to produce a Pd adhesion plate.

[0058] (1) Dip in a pretreatment solution (PIW-1 manufactured by Okuno Pharmaceutical Co., Ltd.) at 45°C for 2 minutes, wash with water, and dip in ATS CONDICLEAN solution (CIW-1 manufactured by Okuno Pharmaceutical Co., Ltd.) at 65°C for 5 minutes. Minutes to roughen the resin substrate.

[0059] (2) Neutralization was carried out by dipping in a pre-soak solution (OPC-SALH manufactured by Okuno Pharmaceutical Co., Ltd.) at 25° C. for 2 minutes.

[0060] (3) Use a catalyst (OPC-SALH manufactured by Okuno Pharmaceutical Co., Ltd., OPC-80 manufactured by the company) at 25°C for 15 minutes, wash with water, and use an accelerator (OPC-505A manufactured by Okuno Pharmaceutical Co., Ltd., OPC-80 manufactured by the company...

Embodiment 8

[0061] (Example 8, Comparative Example 4)

[0062] The glass epoxy resin substrates of Examples 1 to 7 and Comparative Examples 1 to 3 above were replaced with copper plates (manufactured by Hitachi Chemical Co., Ltd., trade name "MCL-E-679", thickness 0.2 mm) and fabricated on copper substrates. The Pd adhesion plate to which palladium was adhered was used as Example 8 and Comparative Example 4.

[0063] The resulting Pd adhesion plate was immersed in the solution formed by the ingredients shown in Tables 1 to 3 (the remainder is ion-exchanged water) and under the conditions of temperature and time, and then the residual Pd was measured. The removal rate is shown in the table 1 to 3.

[0064] [Table 1]

[0065] Complex

untreated substrate

Example 1

Example 2

Example 3

Example 4

chain thiocarbonyl

base compound

DMTU

50wt%

DMTU

0.05wt%

DMTU

6wt%

Thiourea

7wt%

NaCl

10wt%

...

Embodiment 9

[0078] In this example, a copper corrosion rate test was performed. With the compounding liquid of above-mentioned embodiment 6 and the compounding liquid of comparative example 4, promptly the hydrochloric acid of 35% by weight is 8% by weight, the nitric acid of 65% by weight is 20% by weight, and the remainder is the solution that ion-exchange water mixes to compare copper corrosion rate.

[0079] A copper plate (manufactured by Hitachi Chemical Industry Co., Ltd., trade name MCL-E-679, thickness: 0.2 mm, length: 4 mm, width: 4 mm) was immersed in 100 ml of each solution for 1 minute, and the corrosion rate was measured based on the weight change of the copper plate. The results of measuring the corrosion rate for each copper concentration are shown in FIG. 1 . The reason why the corrosion rate at each copper concentration was measured is because the copper concentration in the solution increases and the copper corrosion rate increases when the substrate is continuously pr...

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Abstract

A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound. Thus, the present invention provides the metal removing solution capable of removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, the solution having an excellent property of removing palladium, tin, silver, palladium alloy, silver alloy, tin alloy, and the like without attacking copper, and having an excellent handleability since the solution does not contain any toxic substance; and the removing method using the foregoing metal removing solution.

Description

technical field [0001] The present invention relates to a metal removing liquid for removing palladium, tin, silver, palladium alloy, silver alloy and tin alloy and a metal removing method using the metal removing liquid. Background technique [0002] In the manufacture of electronic substrates such as printed wiring boards, catalyst particles such as palladium and silver are attached as plating catalyst nuclei to an insulating material such as resin, and an electroless copper plating layer is formed as a power supply layer using the plating catalyst nuclei. Then, a photoresist layer is formed on the entire surface, exposure treatment and development treatment are sequentially performed, and a plating resist is formed on the portion other than the portion where the copper wiring is formed. Furthermore, after forming copper wiring on the power supply layer by performing electrolytic copper plating on the part without plating resist, removing the plating resist and unnecessary...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/14C23F1/16
CPCH05K2201/0761C23F1/44H05K3/108C23F1/30H05K3/181H05K3/26C23F1/10C09K13/06
Inventor 秋山大作片山大辅
Owner MEC CO LTD
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