Silicon condenser microphone

Abstract

Provided is a silicon condenser microphone using a case in which a plating layer is formed on a body formed of resin. The silicon condenser microphone includes: a case having a can-shaped body with one side open, the body being formed of a resin, and a plating layer formed on the body; and a substrate on which a micro electro mechanical system (MEMS) microphone chip and an application-specific integrated circuit (ASIC) chip for processing an electrical signal are mounted, a connection pattern for attaching the case is formed, and the case is attached to the connection pattern using a conductive adhesive. The case may be formed in a cylindrical shape or a rectangular box shape. The plating layer may be formed on an inner surface, an outer surface, or an entire surface of the body and a step may be formed along an inner periphery on an end portion of an opening surface of the body. The body is formed of easily moldable resin and the plating layer is formed on the inner, outer, or entire surface of the body to prevent an external noise such as an electromagnetic wave noise from being received from the outside.

Description

technical field [0001] The present invention relates to a silicon condenser microphone, and more particularly to a silicon condenser microphone using a housing having a structure in which a plating layer is formed on a housing main body made of resin. Background technique [0002] Generally, a silicon condenser microphone widely used in mobile communication terminals, audio equipment, etc. is composed of: a bias element; a pair of diaphragms / back plates for forming a capacitor (C ); and a junction field effect transistor (JFET) for buffering the output signal. A condenser microphone of this typical type is manufactured by crimping the end of the case after integrally assembling a diaphragm, a spacer ring, an insulating ring, a back plate, a conductive ring, and a PCB in a single case. [0003] However, such a curling method in which the end of the case is wound while being pressed toward the PCB side to bend it has a problem in that the shape or sound characteristics of the...

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Problems solved by technology

[0003] However, such a curling method in which the end of the case is wound while being pressed toward the PCB side to bend it has a problem in that the shape or sound characteristics of the final product are affected due to the pressure during the process and the tolerance of the parts. make an impact

[0005] However, the casings used in conventional silicon condenser microphones are made of cylindrical or square metal, and there is a problem that molding is difficult.

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