Method for encapsulating LED with rotary glue and optical etching technology
A technology for light-emitting diodes and photolithography, which is applied to electrical components, circuits, semiconductor devices, etc., and can solve the problems of decreased light extraction efficiency, application limitations, and difficulty in ensuring gap-free adhesion.
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[0010] Embodiments of the present invention are further described below in conjunction with the accompanying drawings:
[0011] see Figure 1a and Figure 1b , using multi-layer epitaxy, photolithography, and etching processes to form an array of GaN blue light-emitting chips 13 and electrodes 12 on the chip substrate 11;
[0012] The present invention adopts glue-spinning and photolithography technology, and the glue-spinning process refers to dripping glue 14 containing fluorescent powder when the chip substrate 11 is rotating, so that the glue is evenly dispersed and coated on the chip substrate 11, and the blue-ray chip array containing GaN 13, a phosphor-containing adhesive layer 14 with a uniform thickness is formed on the surface of the chip substrate 11, and a white LED package is realized by photolithography, development, curing, and cutting processes. see figure 2 , its specific process steps are as follows:
[0013] 1) In the photolithography room, add aluminum ...
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