Chip packaging structure

Abstract

A chip packaging structure comprises a chip, a lead frame, a plurality of weld lines and a packaging colloid. Wherein, the chip is provided with a positive surface and a plurality of connecting gaskets arranged on one side of the positive surface. The chip is fixed below the lead frame. The lead frame is provided with a plurality of first inner pins and a plurality of second inner pins. These first inner pins are positioned on the positive surface. In addition, an end of each first inner pin and each second inner pin is arranged peripherally in these connecting gaskets. These weld lines are respectively connected between the first inner pin and the connecting gasket and between the second inner pin and the connecting gasket. The chip, the first inner pin, the second inner pin and the weld line are wrapped by the packaging colloid. For the connecting gasket is positioned on one side of the positive surface, rate of collapsed weld line is reduced.

Description

technical field [0001] The present invention relates to a chip packaging structure, and in particular to a chip packaging structure (CHIP PACKAGE STRUCTURE) with a lead frame. Background technique [0002] In the semiconductor industry, the production of integrated circuits (IC) can be mainly divided into three stages: integrated circuit design (IC design), integrated circuit manufacturing (IC process) and integrated circuit packaging (IC package). [0003] In the fabrication of integrated circuits, chips are completed through wafer fabrication, integrated circuit formation, and wafer sawing. The wafer has an active surface, which generally refers to the surface of the wafer with active devices. After the integrated circuit inside the wafer is completed, the active surface of the wafer is further equipped with a plurality of bonding pads, so that the chips formed by dicing the wafer can be electrically connected to the outside through these bonding pads. carrier. The carr...

AI Technical Summary

Problems solved by technology

[0005] Since these inner pins 122 are arranged along the periphery of the chip 110, the length of these bonding wires 130 is relatively long, and it is easy to collapse and cause an electrical short circuit.

In addition, due to the long length of these bonding wires 130, these bonding wires 130 are also easily torn off by the liquid packaging compound 140 poured into the mold when forming the encapsulant 140, resulting in electrical disconnection.

Therefore, as far as the packaging process is concerned, the design of the existing chip packaging structure 100 is likely to cause a low product yield.

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