Light solidifying composition and burned object pattern obtained using the same

A technology of photocurability and composition, which is applied in the direction of photosensitive materials, optics, and optomechanical equipment used in optomechanical equipment. It can solve the problems of discoloration of glass substrates, difficult oxidation of silver powder, etc., and achieve the effect of reducing yellowing of color

Active Publication Date: 2012-07-04
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] However, in the case of a photocurable composition containing silver powder, there is a problem that silver is diffused by firing, and the glass substrate is discolored to yellow.
[0004] On the other hand, the current situation is that silver powder has been used as a conductive powder even though it is an expensive metal powder due to its property of being difficult to oxidize.

Method used

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  • Light solidifying composition and burned object pattern obtained using the same

Examples

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Embodiment

[0043] Hereinafter, the present invention will be specifically described based on examples, but of course, the present invention is not limited to the following examples. In addition, "parts" in the following description mean parts by mass unless otherwise specified.

[0044] The components shown in Composition Examples 1 to 5 and Comparative Composition Examples 1 to 2 below were blended in respective composition ratios, stirred with a mixer, kneaded with a three-roll mill, and formed into a paste.

[0045] - Solder alloy powder: A powder having an alloy composition ratio (mass %) of 96.5% of tin, 3% of silver, and 0.5% of copper was used. The average particle diameter of this alloy powder is the average particle diameter measured using the particle size distribution measuring apparatus by the laser analysis diffraction method, (D50)=12 micrometers, (D10)=9.5 micrometers, (D90)=15.43 micrometers. In addition, the average particle diameter of 10 randomly selected particles ob...

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Abstract

The invention relates to light solidification compound and sinter pattern. A light solidification compound contains: (A) solder alloy powder, which contains at least one of plumbum (Pb), stannum (Sn), bismuth (Bi), zincum (Zn); (B) organic adhesive; (C) photopolymerization monomer; and (D) initiators for photopolymerization. Wherein, the solder alloy powder is 60-90 wt% in mixture. The light solidification compound of the invention is used to form precise electrode circuit on glass substrate of plasma display panel or ceramic substrate of circuit wiring substrate.

Description

technical field [0001] The present invention relates to a photocurable composition useful for forming a fine electrode circuit on a glass substrate of a plasma display panel (hereinafter, abbreviated as PDP), a ceramic substrate for circuit wiring board, etc., and a fired product obtained by using the composition pattern. Background technique [0002] As a method of forming a patterned layer of a conductor on a glass substrate, a method of forming a pattern by photolithography using a photocurable composition containing silver powder has been proposed (see Patent Document 1). [0003] However, in the case of a photocurable composition containing silver powder, there is a problem that silver is diffused by firing, and the glass substrate is discolored to yellow. [0004] On the other hand, the present situation is that silver powder has been used as a conductive powder even though it is an expensive metal powder due to its property of being difficult to oxidize. [0005] Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004H01B1/22
CPCG03F7/004G03F7/0042G03F7/0045G03F7/0047H01B1/22
Inventor 福岛和信
Owner TAIYO HLDG CO LTD
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