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Ultra-thin and small flaky silver powder and its manufacturing method

A manufacturing method, thin sheet technology, applied in the direction of cable/conductor manufacturing, metal/alloy conductors, conductors, etc., can solve problems such as unevenness, difficult coating, etc., achieve sufficient conductivity and ensure conductivity

Active Publication Date: 2016-04-20
FUKUKA METAL FOIL & POWDER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, powders with conventional thickness tend to have unevenness when thinly applied, making it difficult to apply uniformly.

Method used

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  • Ultra-thin and small flaky silver powder and its manufacturing method
  • Ultra-thin and small flaky silver powder and its manufacturing method
  • Ultra-thin and small flaky silver powder and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] As the flaky silver powder material, the flaky silver powder of Comparative Example 1 was used. 2.5 kg of this powder was put into a medium agitation type wet ultrafine pulverizer (MSC-I00, COKE & ENGINEERING CO., LTD., Nippon COKE & ENGINEERING Co., Ltd.) using micro media with a diameter of 0.1 mm, and subjected to spreading treatment. exist figure 2 The SEM photograph of the obtained extremely thin and small flaky silver powder is shown in the middle.

Embodiment 2

[0082] The ultra-thin flaky silver powder of Example 1 was put into a vortex airflow classifier (Nissin Engineering Co., Ltd., Aerofine Classifier AC-20) for dispersion treatment. exist image 3 The SEM photograph of the obtained extremely thin and small flaky silver powder is shown in the middle. The D of the obtained extremely thin and small flaky silver powder 50 It is 3.8μm and the average thickness is 22nm. The average thickness was measured by preparing a paste with a silver content of 75% by weight, coating it on a flat substrate, and observing its cross-section with an SEM. exist Figure 4 The middle represents the SEM photograph used in the measurement of the average thickness.

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Abstract

The present invention provides a kind of extremely thin small flaky silver powder. When it is used as a conductive filler, it can coat the conductive material thinly and evenly. The particle size is 3-8 μm, and the average thickness is 20-40 nm. In addition, the above-mentioned small flake silver powder material is extended to an average thickness of The manufacturing method of the process of 20-40 nm provides the above-mentioned ultrathin and small flaky silver powder.

Description

technical field [0001] The invention relates to a very thin and small flake-shaped silver powder and a manufacturing method thereof. Background technique [0002] In the frame of electronic parts and electronic equipment, in order to impart conductivity, conductive materials added with conductive fillers are used in resins, and processed into conductive pastes, conductive inks, conductive paints, etc., used for conductive circuit formation, electromagnetic wave shielding, and capacitors electrode formation, etc. [0003] In recent years, as electronic devices such as mobile phones, smartphones, and tablet terminals have become smaller, thinner, and lighter in weight, electronic components used in electronic devices have also been required to be smaller, thinner, and thinner. In addition, along with higher performance and higher functionality of electronic devices, flexibility and stretchability are also required for electronic devices themselves. Therefore, conductive mate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/00B22F9/04H01B5/00H01B13/00B22F1/068
CPCB22F9/04H01B1/02B22F1/068
Inventor 杉谷雄史松本诚一幸松美知夫西田元纪
Owner FUKUKA METAL FOIL & POWDER CO LTD
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