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Flexible capacitance type touch sensor production method

A technology of tactile sensors and flexible capacitors, applied in chemical instruments and methods, piezoelectric/electrostrictive/magnetostrictive devices, instruments, etc., can solve the problems of difficult mass production, large sensor size, manufacturing process and MEMS processing technology Incompatibility and other issues, to achieve the effect of high yield and low cost

Inactive Publication Date: 2010-05-19
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

Zhu and SpronckF.Zhu, J.W.Spronck.Sensors and Actuators 1992, A(31):115~120 The flexible tactile force sensor studied can only detect the distribution of normal force and one-dimensional tangential force at the same time, but in the robot sensor system It is often necessary to detect the distribution of tangential forces in two directions, and none of the above situations is sufficient to fully and accurately evaluate the surface contact situation
Recently, scholars such as Santos (R.F.Santos, P.F.Rocha, et al.EEE ISIE 2005, June 20-23, 2005, Dubrovnik, Croatia, 1539~1544) reported a flexible tactile force sensor that can simultaneously measure three-way force. The size is relatively large, and the manufacturing process is not compatible with MEMS processing technology, so it is difficult to achieve mass production

Method used

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  • Flexible capacitance type touch sensor production method
  • Flexible capacitance type touch sensor production method
  • Flexible capacitance type touch sensor production method

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Embodiment Construction

[0044] A kind of implementation example is specifically introduced below, and the present invention is described in further detail, but the present invention is also suitable for the manufacture of the array structure that is made up of many this flexible capacitive touch sensor units, and this manufacture method provides for the research of other flexible MEMS technology equally Useful experience.

[0045] see figure 1 (a) and (b) are the XZ cross-sectional view of a flexible capacitive tactile sensor and the schematic diagram when it is subjected to an external force F from the environment. figure 2 It is the top view of the capacitive touch sensing sensitive electrodes and driving electrodes. The size design of the flexible capacitive tactile sensor is carried out from the edge effect of the flexible capacitive sensor: the size of the driving electrode 7 is 3500 μm×3500 μm, the size of the sensitive central electrode 4 is 1000 μm×1000 μm, and the sensitive electrode 3 par...

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Abstract

The invention relates to a method for producing flexible capacitor touch sensor, characterized in composed of middle layer preparation of PDMS, preparation of flexible PI substrate, graph metal sensitive electrode and relative electric connection, preparation of a first high-elasticity dielectric layer PDMS and a second flexible dielectric layer PI, graph metal drive electrode and relative electric connection, graph a top flexible insulation protective layer PI, separation of the flexible capacitor touch sensor. The invention optimizes and combines techniques, to realize the compatibility of organic flexible material PDMS, PI and traditional MEMS technique. And the capacitor touch sensor has compact structure, high mechanical strength, and high flexibility, while the product can contact the surface with any curvature to sense the volumes of normal force and tangent force, and be applied for the production of flexile capacitor touch sensor array.

Description

technical field [0001] The invention relates to a manufacturing method of a flexible capacitive touch sensor, which belongs to the technical field of flexible micro-electromechanical systems (MEMS). Background technique [0002] At present, MEMS micro-electromechanical system sensor technology has also developed rapidly due to the continuous progress of micro-processing technology, but most sensors are based on conventional micro-processing technology and are fabricated on rigid substrates such as glass, silicon, and quartz. However, in practical applications, with the increasing demand for flexible structural sensors that can be attached to the surface of arbitrary high-curvature objects, rigid substrate micromachining technology is difficult to meet the needs of applications such as robotic sensitive skin, limb repair technology, foldable electronic devices and wearable Special application requirements such as electronic systems require continuous development of various fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14B25J19/00B81C5/00B81C99/00
Inventor 车录锋肖素艳李昕欣王跃林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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