Fixer andits scanning electronic microscope for testing sample

Abstract

The invention is concerned with the fixing equipment for testing sample, which is used for test semiconductor chip, it includes: the fixing part, the compacted part and the base; the fixing part sets on the base that is with the fixing wall plumbing with the base, the compacted part consists of the active wall that plumbs with the base; forms the space between the fixing wall, the active wall ad the base that is used for fixing the testing sample. The invention is: improving the SEM imaging quality because the sample fixes on the fixing equipment and will not appearing vibrate during the scanning; improving the productivity and testing speed because the width of the sample is adjustable, which provides a multiple production.

Description

technical field [0001] The invention relates to the field of semiconductor chip analysis, in particular to a sample fixing device on a scanning electron microscope sample stage during the preparation and analysis of test samples. Background technique [0002] With the development of semiconductor integrated circuits, electron microscopes are more and more widely used in the microstructure analysis of products. IC (Integrated Circuit) manufacturing is basically built up by layers of patterns, and in order to understand the structure of the stacked patterns to improve the process or solve the failure problem in the process, it is often observed through an electron microscope by using a destructive cutting method , while cutting the cross section (CROSS SECTION) and observing the (crystal garden) cross section are the most basic means to detect the quality of the process. Electron microscopes generally include scanning electron microscope SEM (Scanning Electron Microscopy), tr...

AI Technical Summary

Problems solved by technology

After the sample is ground, it is measured and analyzed by SEM, but since SEM uses electron beam scanning, it will bring heat to the sample, which will cause the temperature of the sample to rise, making the adhesion between the sample and the fixture weak

Therefore, when the cross-section of the sample is scanned by SEM, the cross-section often produces slight jitter or vibration due to weak adhesion. Very slight vibration will cause the image generated by SEM scanning to be blurred and unclear, and accurate data measurement cannot be completed. , resulting in inefficient testing

[0010] Furthermore, with the existing fixtures, during the grinding process, the sample often falls from the fixtures due to the grinding force or high-speed grinding, which leads to the waste of all previous efforts in the sample preparation process.

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