Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pretreatment and pretreatment solution for direct porous metallizing printing IC board

A printed circuit board and hole metallization technology, which is applied in the field of pretreatment solution and preparation of printed circuit boards, can solve the problems of low adhesion strength of the metal coating on the hole wall, difficult quality control, unstable production, etc., and achieve economic benefits And environmental protection is significant, the production process is shortened, and the effect of good stability

Active Publication Date: 2007-09-05
溧阳常大技术转移中心有限公司
View PDF0 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the fine particles of carbon black are difficult to uniform in size, sometimes instability occurs in production, and quality management is difficult to control
For the conductive polymer process of (3), the printed circuit board is first treated with permanganate, and then the printed circuit board is contacted with an aqueous solution of monomers such as pyrrole. After pyrrole is oxidized by permanganate, the printed circuit board is A conductive polymer film is formed on the hole wall of the plate, and the conductivity of the hole wall is given to the method of direct copper plating. However, in this method, the permanganate attached to the hole wall is first used to oxidize pyrrole in the pretreatment, so the The adhesion strength of the obtained hole wall metal coating is not high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pretreatment and pretreatment solution for direct porous metallizing printing IC board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] [Example 1] A pyrrole / polyvinyl alcohol conductive polymer colloid doped with sulfate anions was synthesized according to the following method.

[0019] A specific synthesis example is to dissolve 0.85g (polyvinyl alcohol, analytically pure) in 500ml of warm water at 30°C, then add 7.0g of the oxidizing agent ammonium persulfate and 32.2g of sodium sulfate as an impurity, add water to dilute to 1L, and stir Add 5ml of pyrrole under the condition of , and continue to stir for more than 12 hours to obtain a polymer of pyrrole. The polymer is separated with a high-speed centrifuge (rotating speed is 16000 rpm), and the yellow liquid above is removed to obtain the following black pyrrole polymer. , After washing several times with ion-exchanged water, disperse it in 50ml of water with ultrasonic waves, and obtain a pyrrole polymer colloid solution doped with sulfate ions. The colloidal solution was observed with an electron microscope, and the particle diameter of the polym...

Embodiment 2

[0020] [Example 2] A 3-methylpyrrole / polyvinyl alcohol conductive polymer colloid doped with sulfate anions was synthesized according to the following method.

[0021] A specific synthesis example is to dissolve 0.85g (polyvinyl alcohol, analytically pure) in 500ml of warm water at 50°C, then add 7.0g of the oxidizing agent ammonium persulfate and 32.2g of sodium sulfate as an impurity, add water to dilute to 1L, and stir Add 5ml of 3-methylpyrrole under the condition of , continue to stir for 12 hours, obtain the polymer of 3-methylpyrrole, this polymer is separated with high-speed centrifuge (rotating speed is 16000 rpm), remove the yellow liquid above, Obtain the following black pyrrole polymer, after washing several times with ion-exchanged water, disperse it in 50ml of water with ultrasonic wave, promptly obtain the colloidal solution of the 3-methylpyrrole polymer doped with sulfate ion, this colloidal solution passes through Observed with an electron microscope, the par...

Embodiment 3

[0022] [Example 3] A conductive polymer colloid of polyaniline / polyvinylpyrrolidone doped with perchlorate anions was synthesized according to the following method.

[0023] After adding 0.05g of polyvinylpyrrolidone and 1.40g of perchloric acid into 25ml of deionized water respectively, they were dissolved, and under stirring conditions, 1.25ml of aniline was slowly added, and the prepared ammonium persulfate solution was added dropwise in the solution (weighing Take 3.14g of ammonium persulfate and dissolve it in 25ml of deionized water), and add it within 30min. Stir and react for 6 hours, filter with suction, wash with 1mol / L HCl, then wash to neutral with deionized water, place the product in 50ml deionized water, and after ultrasonic dispersion, obtain the polyaniline / Conductive polymer colloid of polyvinylpyrrolidone. The colloidal solution was observed with an electron microscope, and the particle diameter of the polymer was about 150nm. In addition, 50 μL of the co...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
degree of polymerizationaaaaaaaaaa
Login to View More

Abstract

An electroplating pre-treatment liquid and its production are disclosed. The process is carried out by oxidation polymerizing pyrrole with aniline under existence of adulterant, oxidant and surface activator to obtain conductive polymer, separating conductive polymer and re-dispersing in water to obtain the final product. It's simple and cheap, has better stability, and saves noble metals and no environmental pollution.

Description

technical field [0001] The invention relates to an electroplating pretreatment solution, in particular to a printed circuit board pretreatment solution for directly electroplating holes in a printed circuit board and a preparation method thereof. Background technique [0002] The connection of the inner circuit of the printed circuit board usually adopts the electroplating method of via holes or blind holes. The electroplating method is firstly to make it conductive by electroless copper plating on the drilled empty wall, and then conduct plating. However, in the above-mentioned electroless copper plating process, the reducing agent formaldehyde is used, and formaldehyde has been found to be a strong carcinogen, causing great harm to the environment in which human beings live. In addition, the complexing agent used in the electroless copper plating solution also causes great harm to the environment. For example, EDTA as a complexing agent, etc., is discharged into the river...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/54C25D5/56H05K3/42
Inventor 陈智栋王文昌王金峰刘启发
Owner 溧阳常大技术转移中心有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products