Current-transfer enhanced window layer and LED with the high reflection graph shift substrate structure
A technology for light-emitting diodes and pattern transfer, which is applied in circuits, electrical components, semiconductor devices, etc., and can solve the problems of high cost, low light extraction efficiency, and a large difference between the refractive index and the air refractive index.
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Embodiment 1
[0035] As shown in Figure 6, take AlGaInP LED as an example. The device is composed of the following parts, upper electrode 100, current blocking layer 110, conductive anti-reflection light emitting layer 130, current spreading layer 201, upper confinement layer 300, active region 500, lower confinement layer 400, patterned current spreading Layer 202, conductive highly reflective layer 140, conductive bonding layer 150, transfer substrate 160 and lower electrode 800, the preparation process and method are as follows:
[0036] 1. Growth of the epitaxial wafer: On the substrate 700 formed of GaAs and other materials that can match AlGaInP, the buffer layer 600, the current spreading layer 201, and the lower confinement layer are epitaxially grown in sequence by the method of metal organic chemical vapor deposition (MOVCD) 400, the active region 500, the upper confinement layer 300, and the upper current spreading layer 200, so that the epitaxial wafer of the AlGaInP light-emitt...
Embodiment 2
[0045] As shown in Figure 7, take AlGaInP LED as an example. The device is composed of the following parts, upper electrode 100, current blocking layer 110, conductive anti-reflection light emitting layer 130, current spreading layer 201, upper confinement layer 300, active region 500, lower confinement layer 400, patterned current spreading Layer 202, conductive highly reflective layer 140, conductive bonding layer 150, transfer substrate 160 and lower electrode 800, the preparation process and method are as follows:
[0046] 1. Growth of epitaxial wafers: On the substrate 700 formed of GaAs and other materials that can match AlGaInP, the buffer layer 600, the current spreading layer 201, the lower confinement layer 400, the active region 500, and the upper confinement layer are sequentially grown epitaxially by using the MOVCD system. Layer 300, the upper current spreading layer 200, so just obtained the epitaxial wafer of AlGaInP light-emitting diode, as shown in Figure 5; ...
Embodiment 3
[0055] As shown in Figure 8, take AlGaInP LED as an example. The device is composed of the following parts, upper electrode 100, current blocking layer 110, conductive anti-reflection light emitting layer 130, current spreading layer 201, upper confinement layer 300, active region 500, lower confinement layer 400, patterned current spreading Layer 202, conductive highly reflective layer 140, conductive bonding layer 150, transfer substrate 160 and lower electrode 800, the preparation process and method are as follows:
[0056] 1. Growth of epitaxial wafers: On the substrate 700 formed of GaAs and other materials that can match AlGaInP, the buffer layer 600, the current spreading layer 201, the lower confinement layer 400, the active region 500, and the upper confinement layer are sequentially grown epitaxially by using the MOVCD system. Layer 300, the upper current spreading layer 200, so just obtained the epitaxial wafer of AlGaInP light-emitting diode, as shown in Figure 5; ...
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