Printed circuit board for semiconductor package and method of manufacturing the same

A technology of printed circuit boards and semiconductors, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuits, etc., and can solve the problems of pre-soldering with a pitch of 120 μm or less and high cost in the screen printing method

Inactive Publication Date: 2007-08-01
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, among conventional pre-solder forming techniques, the screen printing method suffers from a problem because it is difficult to realize a pre-solder with a pitch of 120 μm or less.
Furthermore, although the super juffit method and the super solder method can be applied even to a fine pitch of 100 μm or less, they result in high cost

Method used

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  • Printed circuit board for semiconductor package and method of manufacturing the same
  • Printed circuit board for semiconductor package and method of manufacturing the same
  • Printed circuit board for semiconductor package and method of manufacturing the same

Examples

Experimental program
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Effect test

Embodiment 1

[0070] In the product as shown in FIG. 7, all solder parts, bump parts, and wire bond parts (with camera-recognizable marks and mold gates for molding after mounting) are tin-plated. In particular, the pitch of the bump portion is set in the range of 40˜200 μm, and the thickness of the plating layer is changed according to the pitch. In this embodiment, in the case of a pitch of 100 μm, since the bump copper circuit spacing is small, around 30 μm, tin plating is performed to a target thickness of 10 μm. To this end, an electroplating process was performed at 25° C. and 1.0 ASD for 25 min using a PC-MT electroplating solution obtained from Incheon Chemical in Korea, and the resulting plating layer contained at least 99% pure tin. In addition, the electroplating process was performed at 25° C. and 3 ASD for 12 min using UTB-TS 140 electroplating solution obtained from Ishihara Chemical in Japan, and the resulting plating layer contained 97.5% Sn and 2.5% Ag. Once the PCB thus f...

Embodiment 2

[0072] In the product shown in Fig. 8, among the soldering part, the bump part, and the wire bonding part (having a mark recognizable by a camera and a mold gate for molding after mounting), only the bump part Perform tin plating. Except for the bump part, nickel and gold plating is performed on the copper pad. Therefore, the bump portion is covered by the dry film so as not to be plated. Subsequently, when the bump portion is tin-plated, the portion of the substrate other than the bump portion is masked with a dry film so that the nickel and gold plated portion is not tin-plated. The thickness of the nickel plating layer is 2 to 20 μm, which is as thick as a general nickel plating layer. In particular, the pitch of the bump portion is set in the range of 40˜200 μm, and the thickness of the plating layer is changed according to the pitch. In this embodiment, in the case of a pitch of 100 μm, since the bump copper circuit spacing is small, around 30 μm, tin plating is perfor...

Embodiment 3

[0074] In the product shown in FIG. 9, among the soldering part, the bump part, and the wire bonding part (having a mark recognizable by a camera and a mold gate for molding after mounting), only the bump part Perform tin plating. All copper pads are plated with nickel and gold. Subsequently, when the bump portion is tin-plated, a dry film is used to mask the portion of the substrate other than the bump portion so that nickel and gold plating and subsequent tin plating are formed only on the bump portion. In particular, the pitch of the bump portion is set in the range of 40˜200 μm, and the thickness of the plating layer is changed according to the pitch. In the present embodiment, in the case of a 100 μm pitch, since the bump copper circuit interval is small, around 30 μm, the nickel plating layer is formed to a thickness of 1.0 μm, which is smaller than that of a normal nickel plating layer. In addition, tin plating was performed to a target thickness of 10 μm. To this en...

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Abstract

Disclosed are a printed circuit board for a semiconductor package and a method of manufacturing the same. Specifically, a printed circuit board for a semiconductor package includes predetermined circuit patterns, having a wire bonding portion and a bump portion for mounting a semiconductor and a soldering portion for connection to external parts, in which the bump portion has a pre-solder formed using a tin or tin alloy electroplating process. According to this invention, the pre-solder, which is formed by reflow using an electroplating process, permits easy increase of the height thereof to thus enhance bondability and underfilling capability, may be formed to a desired thickness by controlling a plating thickness, and furthermore, may be applied to a fine pitch through a masking process.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2006-0006854, filed on Jan. 23, 2006, entitled "Method for Manufacturing Printed Circuit Board for Semiconductor Package and Printed Circuit Board Made Therefrom," Its entire contents are hereby incorporated by reference. technical field [0003] The present invention generally relates to printed circuit boards (PCBs) for semiconductor packaging and methods of manufacturing the same. In particular, the present invention relates to a PCB for semiconductor packaging and a manufacturing method thereof, wherein pre-solder can be formed on a bump portion using a tin or tin alloy plating process, thereby improving bonding and underfill capabilities, and can be controlled by The plating thickness forms a desired thickness, and among them a fine pitch (or small pitch) is possible. Background technique [0004] With the increase of IC packaging integration, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48H05K1/09H05K3/00
CPCH05K3/3489H05K2203/043H01L2224/81193H05K3/244H01L23/49816H05K3/243H01L2924/01079H05K2203/0723H01L2224/16H01L2924/01327H05K3/3463H05K2203/0574H05K3/3473H01L2924/01078H01L23/49866H01L2224/81191H05K2201/0391H01L2924/01077H01L2224/05573H01L2224/05568H01L2924/00014H01L2924/00H01L2224/05599H05K1/09
Inventor 李容彬裵暻元崔钟敏刘义娟
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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