Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Leadless soft soldering material and manufacturing method

A soft soldering and silver material technology is applied in the field of preparation of lead-free solder, which can solve the problems of lead infiltration into the ground, lead poisoning, harm to human and animal health, etc. Simple and easy effects

Inactive Publication Date: 2009-07-08
昆山成利焊锡制造有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, with the rapid development of electronic products and the enhancement of human awareness of environmental protection, although traditional leaded solder has the advantages of excellent wettability, solderability, good mechanical properties and low price, the heavy metal lead in leaded solder After PCB is soldered, it will be scattered in the environment along with discarded electronic products. After long-term corrosion by acid rain, lead will seep into the ground and dissolve into the groundwater system. After drinking, it will accumulate in the body of humans or animals for a long time, which will cause lead poisoning and harm It affects the health of people and animals, and because people realize the importance of protecting the environment, environmental laws and regulations are becoming more and more perfect and strict.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Example 1: Add 90Kg of refined tin into a graphite crucible for melting, then heat up to 1100°C, add 10Kg of refined copper, stir evenly with a wooden stirring rod and melt into a liquid tin-copper alloy, leave it for 30 minutes to cast into a tin-copper alloy ingot and take it out ;

[0013] Put 90Kg refined tin into the graphite crucible and heat it up to more than 960°C after melting, put in 10Kg pure silver material, wait for the silver material to melt, let it stand for 30 minutes, cast it into a tin-silver alloy ingot and take it out;

[0014] Then put 99Kg of refined tin into the graphite crucible to melt and heat up to 600-1000°C, put in a covering agent to isolate the surface of the tin liquid from oxygen in the air (the covering agent does not participate in the reaction), put in 1Kg of pure selenium, and wait for the selenium to melt. Place it for 30 minutes and cast it into tin-selenium ingot and take it out;

[0015] The three kinds of alloy ingots prepare...

Embodiment 2

[0017] Get the three kinds of alloy ingots prepared in Example 1, Ga, Cu and tin, and prepare them by weight percentage: selenium: 0.05%, copper: 0.8%, silver: 0.5%, Ga: 0.001% and the balance is tin-free lead solder.

Embodiment 3

[0019] Take the three alloy ingots prepared in Example 1, Cu and tin, and prepare by weight percentage: selenium: 0.01%, copper: 1.0%, silver: 0.3% and the balance is lead-free solder of tin.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a lead-free soft soldering. Calculated by weight percentage, the lead-free soft soldering consists of following compositions: 0.1 to 3.9 per cent of Al, 0.0001 to 0.5 per cent of Se and rest of Sn. The method of manufacturing the invention is: (a) after refined tin is added into a plumbago pot to be melted, temperature rises to 1100 DEG C. refined copper is added and evenly mixed. The refined tin and the refined copper are melted to be liquid tin copper alloy. The liquid tin and copper alloy becomes the alloy ingot of tin and copper after standing for 30 minutes; (b) the refined Ag is added and melted again and the temperature rises to above 1600 DEG C. Pure nickel is added and melted. The liquid Ag and nickel becomes the alloy ingot of Ag and selenium after standing for 30 minutes; (c) with the refined tin added into and melted and the temperature rising to above 600 to 1000 DEG C, covering agent is added to isolate the liquid level of tin from oxygen in the air. Pure selenium is added and melted. The liquid tin and selenium becomes the alloy ingot of tin and selenium after standing for 30 minutes; (d) three gold ingots, Ga or Cu and the rest of tin and put into a stainless steel kettle to be melted according to the required formulation, which can be made into a tin wire, a tin bar and a tin ball.

Description

technical field [0001] The invention relates to a preparation method of lead-free solder, which belongs to soldering materials. Background technique [0002] In recent years, with the rapid development of electronic products and the enhancement of human awareness of environmental protection, although traditional leaded solder has the advantages of excellent wettability, solderability, good mechanical properties and low price, the heavy metal lead in leaded solder After PCB is soldered, it will be scattered in the environment along with discarded electronic products. After long-term corrosion by acid rain, lead will seep into the ground and dissolve into the groundwater system. After drinking, it will accumulate in the body of humans or animals for a long time, which will cause lead poisoning and harm It affects the health of people and animals, and because people realize the importance of protecting the environment, environmental laws and regulations are becoming more and mo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26C22C1/02
Inventor 苏明斌严孝钏何繁丽苏传港苏传猛
Owner 昆山成利焊锡制造有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products