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Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer

Inactive Publication Date: 2011-06-16
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0012]In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the composition; and a backgrinding method using the sheet can be provided. The pressure-sensitive adhesive composition according to the present invention, when applied as, for example, a protective film for a semiconductor processing process, can prevent contamination or damage of a wafer due to water or other foreign substances applied during a backgrinding process, can be easily re-released after grinding, and can remarkably improve productivity.

Problems solved by technology

Moreover, as the diameter of the wafer increases, wafer damage such as wafer contamination and cracks frequently occur during the backgrinding process.
However, details disclosed in the foregoing arts are limited to waterborne or emulsion-type pressure-sensitive adhesives and are difficult to apply to solvent pressure-sensitive adhesives.

Method used

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  • Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer
  • Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer
  • Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer

Examples

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example 1

[0061]A monomer mixture (100 parts by weight) comprising isobonyl acrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate was prepared such that 5 parts by weight of isobonyl acrylate (IBOA) were contained in the mixture, and the glass transition temperature of the polymer prepared from the mixture was −25° C. Then, the monomer mixture was polymerized to prepare an acrylic pressure-sensitive adhesive polymer having a solid content of 45 weight %. Next, an isocyanate cross-linking agent was added to the prepared pressure-sensitive adhesive polymer in an amount of 2 parts by weight, relative to 100 parts by weight of the pressure-sensitive adhesive polymer. The resultant was applied to an ethylene-acetic acid vinyl copolymer film having a thickness of 80 μm, and then dried, thus preparing a pressure-sensitive adhesive layer (thickness: 20 μm). The prepared pressure-sensitive adhesive sheet was aged for 2 hours at 50° C., and then subjected to tests to b...

example 2

[0062]Except for the fact that a monomer mixture (100 parts by weight) comprising isobonyl acrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate was used such that 10 parts by weight of isobonyl acrylate (IBOA) were contained therein and the glass transition temperature of the polymer prepared from the mixture was −9° C., the pressure-sensitive adhesive sheet was prepared in the same manner as Example 1.

example 3

[0063]Except for the fact that a monomer mixture (100 parts by weight) comprising isobonyl acrylate, methyl acrylate, ethyl acrylate, n-butyl acrylate and 2-hydroxyethyl acrylate was used such that 20 parts by weight of isobonyl acrylate (IBOA) were contained therein and the glass transition temperature of the polymer prepared from the mixture was −1° C., the pressure-sensitive adhesive sheet was prepared in the same manner as Example 1.

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Abstract

The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobonyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobonyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Description

TECHNICAL FIELD[0001]The present invention relates to a pressure-sensitive adhesive composition, a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition, and a backgrinding method using the pressure-sensitive adhesive sheet.BACKGROUND ART[0002]With the recent tendency towards miniaturization and weight-reduction of electronic products, there is an increasing demand for leadless, thin-film, and high-integration chip semiconductor packages. To meet the demand, a need for large-diameter thin-film wafers included in the semiconductor packages is also increasing.[0003]In order to effectively cope with the tendency towards large diameter thin-film semiconductor wafers, it is important to precisely control a backgrinding process, which is a wafer grinding process, and a dicing process, which is a reorganizing process. To this end, high-performance techniques capable of controlling these processes are required. The backgrinding process involves mech...

Claims

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Application Information

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IPC IPC(8): C08F220/28C09J7/02B32B33/00B32B38/00C09J7/22C09J7/38
CPCC08F220/18Y10T428/1476C09J7/0246C09J133/04C09J133/08C09J133/10C09J2201/606C09J2203/326C09J2423/006C09J2427/006C09J2433/00C09J2467/006C09J2475/006C09J4/06Y10T428/264Y10T428/266Y10T428/2891C08F220/14C08F2220/1808C08F2220/1825C08F2220/281H01L21/6836H01L2221/68327H01L2221/6834C09J7/38C09J7/22C09J2301/302C08F220/1802C08F220/1811C08F220/1804C08F220/20C09J133/06
Inventor KIM, SE RABAEK, YOON JEONGKIM, JANG SOONLEE, JAE KWANPARK, HYUN WOO
Owner LG CHEM LTD
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