Method of manufacturing printed circuit board

Abstract

A method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. The interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a U.S. divisional application filed under 35 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 11 / 585,276 filed in the United States on Oct. 24, 2006, which claims earlier priority benefit to Korean Patent Application No. 10-2005-0125249 filed with the Korean Intellectual Property Office on Dec. 19, 2005, and Korean Patent Application No. 10-2006-0063370 filed with the Korean Intellectual Property Office on Jul. 6, 2006, the disclosures of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a printed circuit board (PCB) and a method of manufacturing the same. More particularly, the present invention relates to a PCB, in which a hydrophilic fluorine resin coating layer is formed on a resin substrate and a dry plating process is performed instead of a conventional wet plating process, thus obtaining a highly reliable fine circuit...

AI Technical Summary

Benefits of technology

[0021]Accordingly, an object of the present invention is to provide a PCB, in which interfacial adhesion of a resin substrate is increased without changing the surface roughness thereof, thus forming a highly reliable fine circuit, and also a method of manufacturing such a PCB.

[0023]A further object of the present invention is to provide a PCB, which may be manufactured in an environmentally friendly manner by replacing a typical wet copper plating process with a dry copper plating process, and also a method of manufacturing such a PCB.

Problems solved by technology

As such, although the material for the resin insulating layer is typically exemplified by epoxy resin, such as FR-4, BT (Bismaleimide Triazine), or ABF (Ajinomoto Build up Film), it is disadvantageous because it has a high dielectric constant (Dk>3.5-[ABF]˜4.5[BT, FR-4]) and a high loss coefficient (Df>0.05), and undesired signal transfer rate and transfer loss are caused, consequently generating heat and deteriorating electrical properties.

Ultimately, a fine circuit having a pitch of less than 50 μm (L / S=25 / 25 μm) is difficult to realize.

However, due to the use of expensive ABF material, the process cost is increased, leading to a high production price.

Furthermore, a fine circuit is difficult to realize, attributable to wet surface treatment and electroless chemical plating.

However, in the conventional SAP, since the copper layer is formed through a wet process such as wet surface treatment and electroless plating, the surface roughness is enlarged, and the formation of the fine circuit is limited.

As well, a lot of waste is generated, therefore the above process is considered environmentally unfriendly.

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