Method and apparatus for manufacturing electronic device using roll-to-roll rotary pressing process

Abstract

Disclosed herein is a method and apparatus for manufacturing an electronic device, which is intended to economically manufacture an electronic circuit device, such as an IC chip, using functional ink and a roll-to-roll rotary pressing process. The method includes a first step of injecting functional ink into a forming groove of a forming roll, a second step of removing ink covering a surface of the forming roll, a third step of drying a surface of the functional ink injected into the forming groove, a fourth step of transferring the dried surface of the functional ink to a printing roll, a fifth step of drying another surface of the functional ink transferred to the printing roll, a sixth step of transferring the functional ink from the printing roll to flexible printing paper which is unwound from a winding roll, and a seventh step of winding the printing paper, on which an electronic circuit is printed, around a rewinding roll.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method and apparatus for manufacturing an electronic device using a roll-to-roll rotary pressing process, which is intended to economically manufacture an electronic circuit device, such as an IC chip, using functional ink and a roll-to-roll rotary pressing process. [0003] 2. Description of the Related Art [0004] As well known to those skilled in the art, electronic devices, such as transistors or ICs, form a circuit pattern using a compact crystal structure of an inorganic material, such as metal or silicone. Thus, an important deposition process, such as a sputtering process, is performed under high temperature and vacuum conditions, using expensive precision equipment.. Most manufacturing and inspecting operations require a very clean environment. Further, the operations are performed not through a constant continuous production method but through a batch production method havin...

AI Technical Summary

Benefits of technology

[0026] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a method and apparatus for manufacturing an electronic device using a roll-to-roll rotary pressing process, which prints an ordinary or inexpensive electronic device on flexible printing paper using a roll-to-roll rotary pressing process, thus economically manufacturing the electronic device, and enhancing productivity.

Problems solved by technology

Thus, an important deposition process, such as a sputtering process, is performed under high temperature and vacuum conditions, using expensive precision equipment.. Most manufacturing and inspecting operations require a very clean environment.

Further, the operations are performed not through a constant continuous production method but through a batch production method having several stages, so that productivity is very low.

In this case, manufacturing costs will further increase.

Moreover, whenever a pattern forming process using photolithography and an etching process are repeated, many chemical cleaning operations must be carried out, thus incurring a heavy burden for waste-water treatment and pollution prevention.

Meanwhile, the production of an IC chip which has a low grade, that is, a kilo-grade, has low economic efficiency.

Thus, even if the kilo-grade chip is required, it will not be produced.

When new-generation RFID / USN electronic devices, which are most electronic devices for general purposes, are manufactured using current silicone semiconductor technology, manufacturing costs are high.

Thus, it is impossible to supply the electronic devices at low cost.

However, the production of the IC chip is not easily realized through the printing method using various kinds of functional ink.

First, the IC chip cannot be produced through printing because of an ink material.

Inventive ink material is still in an initial development stage with respect to characteristics, durability, and cost, so that it is unfeasible to use the ink material in practice.

That is, the quality of the ink material and production technology therefor are insufficient, so that the ink material cannot be mass-produced.

Further, if a printer, which is the important element for producing a printed IC chip, is not modified to be suitable for manufacturing IC chips but is a general printer for printing graphics or images, it is impossible to develop or produce a micro printed IC chip as desired.

However, if a print having a finer pattern is required, it is impossible to manufacture a desired electronic device using the general screen printer.

However, the resolution of the equipment has not reached the resolution required for manufacturing IC chips.

No matter how the precision screen printer or the stencil printer is developed to be generally used for producing electronic devices, it does not overcome the limitation of the stage production process.

However, unless a new rotary pressing technology and a new ink transfer method for a printed IC chip, which must be fundamentally superior to existing image information printing technology and printers optimized for a person's visual discrimination, are developed, a conventional rotary press cannot be utilized.

In order to perform even a printing test of a conventional printer, a person must master a complicated plate-making operation and a difficult multi-stage control operation for driving the printer.

However, the ink jet printing method basically uses dot printing technology, unlike other printing methods.

Thus, several problems may occur in the application of the ink jet printing method to line pattern printing.

In a detailed description, the ink jet printing method is disadvantageous compared to a typical printing method which is performed in a contact manner using a printing plate, in consideration of a pin hole forming a line using dots, gaps, surface roughness, edge roughness, difficulty in forming lines of various widths, and positional misalignment when repeatedly printing.

Further, in the case where mass production is attempted, the movement of many nozzles when a plurality of engine sets comprising a great number of ink jet heads is moved is complicated in comparison with a very simple printing using a printing plate.

Hence, it is difficult to obtain uniform print quality, especially when micro printing.

However, this method is used as a process replacing only a photolithography process in a silicone semiconductor production process, unlike the original intention.

However, the technology making a silicone-rubber printing plate having a fine pattern corresponding to a sub micro grade using advanced silicone semiconductor technology, and realizing the pattern of a fine corrosion-preventing film using SAM ink, which is an expensive high-grade material, is used only for producing expensive IC chips.

Therefore, the soft lithography printing method is not printing technology suitable for efficiently producing a printed IC chip that is inexpensive and has a simple function.

However, it may only substitute for photoresist patterning in the silicone semiconductor process, and is only useful as a batch printing method for a substrate having a larger area.

That is, according to the prior art, a shaft and gears are complicatedly mechanically coupled to one main motor, thus rotating many cylinders of respective units.

Further, the ink supply amount is automatically controlled by vision control employing a digital camera, and the drive cylinder of each printing unit is delicately controlled with respect to the rotating direction and the axial direction for the purpose of precise registration.

However, the current rotary press for printing newspaper cannot be used to print an IC chip.

However, since the current printing technology is set to 100 μm, the technology cannot be applied to print and produce an IC chip requiring a design rule of 10 μm.

However, the line pattern of the printed IC chip does not tolerate the above-mentioned printing defects, but strictly requires the printing of a pattern and shape having reliable physical parameters.

That is, printing which produces a line-gain beyond an allowable tolerance, in addition to having the problems of pin holes, discontinuities, roughness, etc., is unacceptable.

Further, printing layers printed one by one must be neatly transferred, the physical properties of overlapping printing layers must not be mixed with each other, and insufficient drying, leading to intermixing, is unacceptable.

However, when an IC chip is produced through a roll-to-roll rotary pressing process, desired productivity and economical efficiency cannot be achieved unless real-time inspection is conducted through a non-contact type of in-line inspection method, as in general printing.

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