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Fiber adhesive material

a technology of adhesive tape and fiber, applied in the field of adhesive tape, can solve the problems of limiting the overall performance of the thermal control system, requiring special fixation for attaching, and not being reusable or easily removable, and achieve the effect of enhancing the performance of the adhesive tap

Inactive Publication Date: 2006-09-28
KNOWLES TIMOTHY R +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013] Yet another aspect of the present invention is a method for enhancing the performance of an adhesive tape made from a plurality of predominantly aligned carbon fibers having diameters of less than approximately 15 microns. The method comprises placing a plurality of nanofibrils having diameters of approximately 1 micron proximate to at least some tips of the predominantly aligned carbon fibers, and depositing a film on an end portion of the nanofibrils.

Problems solved by technology

While individual elements might have very high conductance, the heat transfer rate between contact surfaces of the two elements can limit overall performance of the thermal control system.
Brazing and gluing with adhesive is strong, but not reusable nor easily removable.
Bolts can be heavy and require special fixturing for attaching.
Tape is not very strong, tends to leave a residue, and loses its sticking ability with use.
It does not work well in wet environments.

Method used

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Examples

Experimental program
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Effect test

example

[0064] Pitch carbon fiber gasket sample cs7-144 was processed in the PE-HF CVD reactor under the conditions listed in Table 1

TABLE 1PE-HF CVD deposition conditions of pitch fiber gasketsampleSample#cs7-144MountingLying flat on anodeconditionsPlasma power160 WHF power300 WMax temperature527° C.Plasma etch time12 minDeposition time 5 minHydrocarbon gasAcetyleneMass gain4.6 mg (5%)Resulting depositHeavy, bottom side

[0065] After the chamber cooled, the sample was removed and examined under the microscope. The bottom of Sample cs7-144 was covered with carbon deposit that was visible under the optical microscope. The 90.5 mg sample had gained 4.6 mg, which corresponds to a 4 micron-thick, uniform layer of carbon over one surface. Some areas displayed thicker deposits than others did. The variation may reflect variation in local temperature, hydrocarbon concentration, and / or catalyst microstructure.

[0066]FIG. 5 is a 250× SEM image of a pitch carbon fiber gasket, looking from above, prior...

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Abstract

A fiber velvet comprising nano-size fibers or nanofibrils attached to micro-size fibers is disclosed. Methods of manufacturing the velvet as well as various uses of the velvet are also described. For example, the fiber velvet can be used as a thermal interface or as an adhesive material. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of the micro-size or larger diameter fibers. Various attributes of the micro-size fibers and of the nano-size fibers, for example, geometry (e.g. size, length, packing density) material type (e.g. carbon, metal, polymer, or ceramic) and properties (e.g. conductivity, modulus, surface energy, dielectric constant, surface roughness) can be selected depending on the desired attributes of the fiber velvet. The nanofibrils have a diameter of less than about 1 micron, and may advantageously be formed from single walled and / or multi-walled carbon nanotubes.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of U.S. patent application Ser. No. 10 / 464,830, titled Fiber Adhesive Material, and filed on Jun. 17, 2003, which claims priority to U.S. Provisional Patent Application Ser. No. 60 / 390,239, titled Dendritic Adhesive, and filed on Jun. 17, 2002 and is a continuation-in-part of U.S. patent application Ser. No. 09 / 593,587, titled Thermal Interface, and filed on Jun. 13, 2000, which claims priority to U.S. Provisional Patent Application Ser. No. 60 / 139,443, entitled Thermal Interface, and filed on Jun. 14, 1999. The entire disclosures of all of these applications are hereby incorporated by reference in their entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The invention relates to adhesive materials such as tapes that provide a dry and reusable medium for adhering two surfaces together. [0004] 2. Description of Related Art [0005] Much of thermal management involves the transfer of...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B37/00C09J7/00F28F3/02H01L23/36H01L23/427
CPCB82Y10/00Y10T428/294C09J7/00C09J2201/626F28F3/022H01L23/36H01L23/4275Y10S428/903B08B1/00H01L2924/0002B82Y30/00Y10T428/2935B08B7/0028Y10T428/24132Y10T428/2913Y10T428/292Y10T428/298H01L2924/00H01L23/373Y10T442/603Y10T442/614Y10T442/608Y10T428/23957Y10T428/23993C09J2301/31
Inventor KNOWLES, TIMOTHY R.SEAMAN, CHRISTOPHER L.
Owner KNOWLES TIMOTHY R
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