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Method for selective laser sintering for quick and direct production of injection die

A technology of laser sintering and injection molding, applied in the direction of digital control, comprehensive factory control, electrical program control, etc., can solve the problems of high cost, difficult to control the forming process, low precision, etc., achieve low cost, short processing cycle, and widen the scope Effect

Inactive Publication Date: 2007-05-30
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The second is the DMLS (Direct Metal Laser Sintering) method represented by the German EOS company, that is, the technology of directly sintering metal without an intermediate binder to directly manufacture metal molds. The materials used are Direct Metal 100, Direct Metal 50, and Direct Metal 20. , DirectSteel150, Direct Steel120, etc., the strength of the injection mold manufactured by it can reach 491MPa. This method is simple in process, but the forming process is difficult to control, the precision is low and the cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0017] (1) Use the 3D modeling software to design the CAD 3D model of the part, then process it with the slicing software and save it as an STL file, and send the data information of the STL file to the SLS rapid prototyping machine.

[0018] (3) Lay a layer of raw powder material at the bottom of the powder bed of the selective laser sintering machine, using CO 2 Or the YAG laser scans and sinters the selected area with the laser beam guided by the information of the precise slice level. At the position where the laser is irradiated, the powder materials are sintered together. The next layer of powder is laid and sintered, and the new layer is naturally sintered with the previous layer. The laser spot diameter is 100μm, the scanning distance is 0.1mm, the scanning speed is 1500mm / s, the laser power is 15W, and the thickness of the single layer Take 100 μm and scan the composite powder.

[0019] The raw material powder is a polyamide / copper composite material, wherein the par...

example 2

[0024] (1) Use the 3D modeling software to design the CAD 3D model of the part, then process it with the slicing software and save it as an STL file, and send the data information of the STL file to the SLS rapid prototyping machine.

[0025] (2) Spread a layer of raw material powder at the bottom of the powder bed of the selective laser sintering machine, and use CO 2 Or the YAG laser scans and sinters the selected area with the laser beam guided by the information of the precise slice level. At the position where the laser is irradiated, the powder materials are sintered together. Then carry out the next layer of powder spreading and sintering. The new layer and the previous layer are naturally sintered together. The laser spot diameter is 100 μm, the scanning distance is 0.1mm, the scanning speed is 2000mm / s, the laser power is 20W, and the thickness of the single layer Take 80 μm.

[0026] The raw material powder is a polyamide / copper composite material, the particle size...

example 3

[0031] (1) Use the 3D modeling software to design the CAD 3D model of the part, then process it with the slicing software and save it as an STL file, and send the data information of the STL file to the SLS rapid prototyping machine.

[0032] (2) Lay a layer of powder material at the bottom of the powder bed of the selective laser sintering machine, using CO 2 Or the YAG laser scans and sinters the selected area with the laser beam guided by the information of the precise slice level. At the position where the laser is irradiated, the powder materials are sintered together. The next layer is powdered and sintered, and the new layer is naturally sintered with the previous layer. The laser spot diameter is 100 μm, the scanning distance is 0.1 mm, the scanning speed is 3000 mm / s, and the laser power is 25 W.

[0033] The raw material used is polyamide / copper composite material, the particle size of copper powder is -300 mesh, and the mass ratio of copper powder to polyamide powde...

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PUM

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Abstract

A selective laser sintering quick manufacturing of the mold comprises CAD three dimension model design, storing STL files after treatment by the section software, sending the STL data to SLS quick forming machine. Spreading a composite powder of polyamide and copper on the power bed of selective laser sintering machine, with copper powder grain side 200--400, their weight ratio ranging 2:1-7:1, scanning and sintering in the selected zone of the laser harness, laser speckle 10-250 mum, scanning distance 0.04-0.1mm, scanning speed 1000- 3000mm / s, single layer thickness 70-150 mum, repeating till the formation of the complete mold inlaid, coating the surface with epoxide resin or acrylic acid series solidification system, polishing the surface thereafter. It is simple in process, short in processing period, low in cost, suitable for small volume plastic parts pilot run, testing and production.

Description

technical field [0001] The invention belongs to the field of advanced rapid manufacturing, and in particular relates to a method for rapidly and directly manufacturing injection molds through selective laser sintering. technical background [0002] Mold technology is one of the most widely used technologies in the manufacturing industry today. With the rapid development of the automobile and home appliance industries, the proportion of injection molds in the entire mold industry is increasing day by day. Traditional injection molds are mainly made by machining methods such as turning, milling, planing, drilling, grinding, and electro-erosion. It is difficult for the drilling cooling channel to conform to the main contour of the injection molded part, and the cooling efficiency is low, which may easily lead to The uneven cooling of various parts of the plastic causes warping and deformation of the workpiece, and the processing cycle is long and the cost is high. Especially for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105G05B19/18
CPCY02P10/25Y02P90/02
Inventor 史玉升黄树槐郭婷刘锦辉徐文武程迪
Owner HUAZHONG UNIV OF SCI & TECH
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