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Method for fabricating lead frame of triode

A technology of lead frame and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of waste of electroplating energy costs, unstable quality control, and high production costs, so as to improve production efficiency and benefit quality The effect of controlling, reducing production costs and energy costs

Active Publication Date: 2007-05-09
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the production process is a single row of tapes, the manufacturing efficiency is relatively low, the relative production cost is relatively high, and the quality control is relatively unstable; and in the electroplating process, the cost of electroplating energy is wasted

Method used

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  • Method for fabricating lead frame of triode
  • Method for fabricating lead frame of triode

Examples

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Embodiment Construction

[0016] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0017] As shown in Figure 1, the (TO-92) single-row lead frame tape punched out in the prior art has the connecting parts of the side tape 1 and the middle rib 2, and the area that needs to be electroplated is the head area of ​​the lead frame tape. This is area A in the figure. Then separate the lead frame tape: cut the side tape 1 and the middle rib 2 horizontally (that is, along the vertical direction in FIG. 1 ), and then obtain a plurality of lead frame sheets, each lead frame sheet includes a plurality of lead frames.

[0018] The manufacturing method embodiment of lead frame of the present invention:

[0019] a. Stamping process: first stamping and manufacturing (TO-92) lead frame tapes, as shown in Figure 2, stamping and manufacturing two lead frame tapes connected by connecting ribs 4 from the same workpiece, and then removing connecting ribs 4...

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PUM

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Abstract

The invention discloses method for fabricating lead frame, especially punching method for fabricating lead frame in use for triode. The method includes steps: (1) producing tape coiling of lead frame through punching: fabricating two pieces of tape coiling of lead frame connected through splice bars from same work piece by punching operation, then removing splice bars; the said tape coiling is two rows of single tape coiling of lead frame; through parting cut points on outer edge of head part of tape coiling, two rows of single tape coiling are connected; (2) plating the head parts and the parting cut points; (3) truncating off the parting cut points, and cutting off separated tape coiling of lead frame so as to obtain multiple pieces of lead frame, each piece of lead frame includes multiple lead frames. Features are: high production efficiency, reduced cost, and decreased pollution on environment.

Description

technical field [0001] The invention relates to a method for manufacturing a lead frame, in particular to a method for stamping and manufacturing a lead frame for a triode. Background technique [0002] The manufacturing method of a lead frame is roughly divided into two types, one method manufactures a lead frame by etching, and the other method manufactures a lead frame by punching. Among the methods of manufacturing lead frames, the method of manufacturing lead frames by punching has the advantage of high-speed processing capability, but since the lead frame is formed in the workpiece by forming a single row of lead frame tape, there is a limitation in obtaining products from the workpiece speed. [0003] The existing (TO-92, industry general model) series triode lead frame tape, its production process is to produce a single row of lead frame tape by stamping, and then electroplate the head area of ​​the lead frame tape through the electroplating process. Then enter the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
Inventor 曹光伟段华平
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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