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LED device with protective circuit of diode

A technology of light-emitting diodes and diodes, applied in circuits, electrical components, electric solid-state devices, etc., can solve the problems of reduced chip life, inability to effectively screen light-emitting diode chips, damage to light-emitting diode chips, etc., and achieve high reliability.

Inactive Publication Date: 2006-12-06
邢陈震仑
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although this kind of electrostatic protection device using a zener diode chip connected in parallel with the light emitting diode chip can provide the electrostatic protection effect of the device, its disadvantage is that it is impossible to perform a reverse voltage test on the protected light emitting diode chip
Since the reverse voltage test of LED chips has always been a standard test item for LED devices, the purpose is to use this test to screen out defective LED chips. The chip may have potential defects, which will greatly reduce the life of the chip. Eliminating products with too high reverse current can effectively improve the reliability of the product
The execution of this device will cause the Zener diode to be turned on when the reverse voltage test is carried out on the LED device, so that the reverse current of the LED chip cannot be measured, so that the LED chip with potential problems cannot be effectively screened. , so that the reliability of the product is greatly reduced
[0007] There are also other prior art ESD protection devices using more than one zener diode, such as U.S. Patent No. 6,642,550, which designs two back-to-back zener diodes on the carrier of the light-emitting diode chip. However, the purpose of this patent is to reduce one welding line and Did not consider how to select the Zener diode to meet the reverse current test of the LED chip, nor did it consider the selection of the Zener diode as an overvoltage protection for the LED chip, because some circuit designs may have an instantaneous power switch. The possibility of surge, so when the instantaneous surge voltage of the line is higher than the limit of the LED chip, it may damage the LED chip
In addition, designing the Zener diode on the carrier of the LED chip can only be used for the LED chip with a flip-chip design, and cannot be used for the LED chip whose electrodes are located on the front of the chip, and the carrier will also increase additional costs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Figure 5 for in figure 1 and image 3 A technical improvement of the light-emitting diode device shown. Such as Figure 5 As shown, a blue light-emitting diode chip 100 is fixed on a metal lead frame, and the metal lead frame has a reflector 110 and a solid crystal area formed by plastic, and the positive electrode of the chip is connected to the metal lead frame by welding with gold wire or aluminum wire 160. The positive electrode 131 of the chip is connected, and the negative electrode of the chip is connected with the negative electrode 132 of the metal lead frame in the same way. A P-type Zener diode chip 141 is fixed with silver glue on the positive metal lead frame, and its breakdown voltage is 6V; another P-type Zener diode chip 142 is also fixed with silver glue on the negative metal lead frame, and its breakdown voltage is The voltage is 12V. The bonding pads of the two P-type Zener diode chips are connected by gold wire or aluminum wire 160, and the pla...

Embodiment 2

[0028] Such as Figure 7 As shown, a metal lead frame containing positive lead 131 and negative lead 132 is covered with plastic shell 115, and a die-bonding area and a wiring area are exposed, and a light-emitting diode chip 100 is fixed on a printed circuit board in a flip-chip manner. On the carrier 170 of a ceramic material circuit board, a silicon substrate, or a combination thereof, the carrier is provided with a circuit to connect the positive and negative electrodes of the chip, and then adhered to a metal heat sink 180 with thermally conductive adhesive, and the metal heat sink is covered by the above-mentioned plastic shell. Covered but the bottom is exposed, the positive pole of the carrier is connected to the positive pole of the metal lead frame by gold wire or aluminum wire 160 welding, and the negative pole of the carrier is connected to the negative pole of the metal lead frame in the same way; Fix another P-type Zener diode chip 141 with silver glue, and its bre...

Embodiment 3

[0031] Such as Figure 9 As shown, a white light-emitting diode device includes a set of positive and negative metal lead frames 130, a heat dissipation conductor 180 formed of copper metal, and a plastic shell 115 covers the two metal lead frame electrodes and heat dissipation conductors to form a die-bonding area. And the bottom of the heat dissipation conductor is exposed outside the plastic shell. A light-emitting diode blue chip 100 is fixed on the heat dissipation conductor, and the positive and negative pads of the blue chip are welded to the positive and negative metal lead frame with gold wire or aluminum wire, and fixed on the heat sink with silver glue at the same time An N-type zener diode 145 with a breakdown voltage of 5 volts and an N-type red light-emitting diode 146 are connected to the pad of the red light-emitting diode chip to the positive metal lead frame by gold wire or aluminum wire welding, and in the same way Connect the bonding pad of the sodium-zene...

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PUM

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Abstract

The LED device includes following parts: a LED for converting electrical energy to electromagnetic wave; a set of lead wire frames in use for connecting LED to external electrical source; a group containing multiple Zener diodes, and at least one set being as back to back coupling or face to face coupling. Through gold wire or aluminum wire being connected to a lead wire frame, the set of Zener diode is connected to LED in parallel. Besides function of electrostatic protection, the invention can carry out test of reverse voltage in order to screen out products with potential problems. The invention also makes LED device possess overvoltage protection so as to be possible to maintain service life and quality in severe condition.

Description

technical field [0001] The invention relates to a light emitting diode device, in particular to a light emitting diode device with a diode protection circuit. Background technique [0002] Conventional light-emitting diode devices such as figure 1 As shown, the light-emitting diode chip 100 is placed on a metal lead frame, and it is electrically connected to the positive electrode 131 and the negative electrode 132 of the metal lead frame by using gold wire or aluminum wire to form an electrical path. The metal lead frame part A die-bonding area and a reflective plate 110 are formed by being covered by a plastic shell, and the reflective plate is covered with an epoxy resin 150 with good light transmission. Sometimes in order to provide better LED chip protection or optical functions, the LED is first covered with silicone (Silicone), or even mixed with phosphor powder in the silicone or epoxy resin to match the blue LED chip to produce white light. This device Has been wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/58
CPCH01L2224/45124H01L2224/45144H01L2224/48247H01L2224/48091
Inventor 邢陈震仑洪荣豪
Owner 邢陈震仑
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