Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Antistatic tapes and method for producing thereof

An antistatic, antistatic layer technology, applied in conductive adhesives, optics, transportation and packaging, etc., can solve the problems of static electricity, dust sticking to the surface of the belt, and static electricity on the adhesive surface cannot be avoided, so as to achieve good durability Receptivity, the effect of maintaining antistatic properties

Inactive Publication Date: 2006-11-22
徐光锡
View PDF1 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the removal of the tape from the surface to which it is attached, there are the following problems: static electricity is generated so that surrounding dust sticks to the tape surface; and / or residual electrostatic charges on the tape surface damage the glass matrix or cause damage to other components
However, although the adhesive tape produced by this technique can avoid the generation of static electricity in the process of unwinding the wound tape, it has a problem that it cannot avoid Static electricity generated on the bonding surface
Also, although antistatic layers made by this technique can be formed by hardfacing organic or inorganic silicates, the problem with preparing hardfacing layers is that it requires a high temperature curing process at at least about 120°C
When the curing process is carried out at a low temperature of 60-70°C, it takes a longer time of about 24-100 hours, and the solvent resistance of the surface hardened layer is reduced
Especially in the case of adhesive tapes comprising polymer films such as polyethylene or polystyrene polymer films that cannot be processed at high temperatures, the above techniques must be used at low curing temperatures, thus reducing the solvent resistance of the tape product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Antistatic tapes and method for producing thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Dissolve 10 g of 3,4-polyethylenedioxythiophene dispersion, 30 g of 30% methoxyformamide solution, 0.2 g of p-toluenesulfonic acid, 0.01 g of Zonyl (Dupont Co.) and 0.2 g of ethylene glycol into 60 g of a mixed solution of ethanol and isopropanol. The resulting solution was coated on a polyester film, followed by drying at 100° C. for 2 minutes. The film thus prepared had a surface resistivity of 10 as measured by the ASTM D3359 standard test method. 5 Ohm / square meter, adhesion is 5B. The prepared film had a transmittance of 98% at a wavelength of 550 nm. The film was then coated with an adhesive component and left to stand for 5 days with a resistivity of 10 5 ohms / square meter.

[0041] A 5 micron thick epoxy adhesive layer was also formed on the prepared conductive polymer film. The surface resistivity of the adhesive layer was measured to be 10 8 ohms / square meter.

Embodiment 2

[0043] 3.5 millimoles of 3,4-ethylenedioxythiophene, 8.1 millimoles of iron tosylate and 2.3 millimoles of ethanol were dissolved in 15 grams of ethanol. The solution was coated on a polyester film at a thickness of 1.5 μm and then placed in a thermal circulation oven at 100° C. for 2 minutes to induce the reaction. After the reaction was completed, the film was taken out of the oven, and its surface was washed with ethanol and dried, thereby preparing a transparent antistatic film. The surface resistivity of the prepared film was 10 3 ohms / square meter.

[0044] A 5 micron thick epoxy adhesive layer was also formed on the prepared conductive polymer film. The surface resistivity of the adhesive layer was measured to be 10 8 ohms / square meter.

Embodiment 3

[0046] 5 parts by weight of iron toluenesulfonate as an oxidizing agent and a dopant were dissolved in 95 parts by weight of n-butanol. The solution was coated on a polyester film and dried in an oven at 80 °C for about 1 min. The resulting film coated with oxidant and dopant was reacted in a closed chamber filled with a gaseous mixture solution of 3,4-ethylenedioxythiophene monomer and ethanol. At this time, the mixing ratio of 3,4-ethylenedioxythiophene monomer and ethanol was 5:5. The temperature in the chamber is about 50° C., and the reaction time is about 5 minutes. Conductive polymer films were produced under the reaction conditions. The surface resistivity of the prepared conductive polymer film is 10 5 ohms / square meter.

[0047] A 5 micron thick epoxy adhesive layer was also formed on the prepared conductive polymer film. The surface resistivity of the adhesive layer was measured to be 10 9 ohms / square meter.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
adhesivityaaaaaaaaaa
Login to View More

Abstract

The invention relates to a manufacturing method of an antistatic adhesive tape. More specifically, the present invention relates to an adhesive tape, wherein one surface of the tape has a resistance of 108-1011 ohm / square by forming a conductive polymer-based antistatic layer on the surface and forming an adhesive layer thereon. Surface resistivity, the other surface has a controllable surface resistivity of 103-1010 ohms / square meter by forming a conductive polymer-based surface hardening layer on it, and has good resistance to various solvents. The adhesive tape produced by the method of the present invention does not generate static electricity even when it is removed from the surface of the electronic component or film to which the tape is attached. Also, the tape has good antistatic properties on its surface when adhered or attached to the surface of an electronic component or film. In addition, the tape has good resistance to various solvents.

Description

technical field [0001] Generally, the present invention relates to a protective tape having antistatic properties and hard-coating properties, which can be used on the surface of electronic components and various films. More specifically, the present invention relates to a method for producing a protective tape and a protective tape produced thereby, in which static electricity is not generated when the tape is removed from the surface of an electronic component or film to which the protective tape is attached, and The protective tape not only has good antistatic properties on the surface to which the tape is attached, but also has good resistance to various solvents. Background technique [0002] For delicate electronic components and films for display devices, adhesive or adhesive (hereinafter "adhesive") tapes are generally used to protect expensive electronic components and films. Because of the typical adhesive nature of this tape, it is generally attached to the surfa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J9/02
CPCC09J9/02G02F2202/22G02F2202/28C09J7/38C09J7/22C09J7/29Y10T428/28Y10T428/1476C09J2301/162
Inventor 徐光锡金钟银金太永金润相
Owner 徐光锡
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products