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Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

A technology for covering films and compositions, applied in the direction of adhesive types, film/sheet adhesives, lamination, etc., can solve the problem of poor migration resistance, expensive nitrile rubber, and materials that are impossible to use on a large scale and other problems, to achieve the effect of good flame retardant performance

Inactive Publication Date: 2006-10-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Known materials meeting the above requirements include, for example, adhesive compositions comprising epoxy resins, aromatic phosphate esters, curing agents, and high-purity nitrile rubber, and flexible copper-clad laminates and laminates using the adhesive compositions. cover layer (see patent reference 1), but high-purity nitrile rubber is very expensive, which means that the material is not likely to be used on a large scale except for specific specialized applications
In addition, adhesive compositions comprising epoxy resins, aromatic phosphate esters, nitrogen-containing novolac resins, and normal-purity nitrile rubber, and flexible copper-clad laminates and coverings using the adhesive compositions are also known (see patent reference 2), but because these materials use nitrile rubber of normal purity, their migration resistance tends to be poor

Method used

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  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
  • Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] Combine each component of the adhesive composition according to the ratio shown in the column of Example 1 in Table 1, and then add a mixed solvent of methyl ethyl ketone and dioxolane to the resulting mixture to obtain wherein the organic solid component and the inorganic solid component The total concentration of the points is 35% by mass of the dispersion.

[0136] Apply the above dispersion to the surface of polyimide film A (trade name: Kapton H, manufactured by DuPont Toray Co., Ltd., thickness: 25 µm) using an applicator in an amount sufficient to make the coating thickness after drying The coating layer was dried at 120° C. in a forced-air oven for 10 minutes, thereby changing the composition to a semi-cured state. The dispersion-coated surface of the polyimide film A and one side of the rolled copper foil were then bonded together by thermocompression bonding using a roll laminator at 120° C. and a linear pressure of 2 kg / cm (commercial product Name: BHY22BT, ...

Embodiment 2

[0138] A flexible copper-clad laminate was prepared in the same manner as in Example 1, except that each component of the adhesive composition was combined in the ratio shown in the Example 2 column of Table 1. The properties of the flexible copper-clad laminates were also determined according to Test Method 1 below. The results are shown in Table 1.

Embodiment 3 to 6

[0151] Dispersions were prepared in the same manner as in Example 1, except that each component of the adhesive composition was combined in the ratios indicated in the columns of Examples 3-6 in Table 2, respectively. Meanwhile, under predetermined conditions (pressure: 13.3Pa, argon flow rate: 1.0L / min, voltage used: 2kV, frequency: 110kHz, power: 30kW, processing speed: 10m / min) to the polyimide film B ( Trade name: Apical NPI, manufactured by Kanegafuchi Chemical Industry Co., Ltd., thickness: 25 μm) was subjected to low-temperature plasma treatment on one side, and then each of the above dispersions was applied to the low-temperature plasma-treated polyimide film using an applicator Surface, in an amount sufficient to give a dry coating thickness of 25 μm, and then dry the coating in a forced-air oven at 90° C. for 10 minutes to change the composition to a semi-cured state to produce a cover film. The properties of the cover film were determined according to Test Method 2 ...

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Abstract

Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and / or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties). The composition can be used for producing an adhesive sheet, a coverlay film, and a flexible copper-clad laminate.

Description

technical field [0001] The present application relates to an adhesive composition which is halogen-free and gives a cured product which exhibits excellent flame retardancy once cured, and also relates to adhesive sheets, cover films and Flexible copper-clad laminate. Background technique [0002] Adhesives commonly used for electronic materials such as semiconductor sealing materials and glass epoxy-based copper-clad laminates include bromine-containing epoxy resins or phenoxy resins or the like to ensure an excellent level of flame retardancy. However, since these compounds containing halogens such as bromine release toxic gases when burned, such as dioxin-based compounds, the use of halogen-free materials in adhesives has been a research hotspot in recent years. [0003] On the other hand, flexible copper-clad laminates that are thinner than the above-mentioned glass-epoxy-based copper-clad laminates and can provide additional soft properties are being widely used, and as...

Claims

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Application Information

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IPC IPC(8): C09J163/00B32B15/088B32B37/12C09J7/02C09J109/02C09J133/00C09J167/00
Inventor 中西畅近藤和纪星田繁宏天野正
Owner SHIN ETSU CHEM IND CO LTD
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