Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Receiving base band of chip electronic element

An electronic component, chip-type technology, applied in the direction of flexible covering, biological packaging, coating, etc., can solve the problems of no discovery, not fundamental, not to improve the performance of preventing the occurrence of fuzz, and achieve excellent bonding strength. Effect

Active Publication Date: 2006-08-30
OJI PAPER CO LTD
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] So far, as a method of preventing fuzzing when the top seal tape is peeled off, the development of a device for detecting the unbonded portion of the tape is known (Patent Document 1); it is not a fundamental method for preventing the unbonded portion , but a countermeasure against the breakage of products using plastic base materials as the base material (Patent Documents 2, 3, 4); instead of improving the performance of preventing the occurrence of fluff caused by peeling of the paper carrier belt, the use of a size press A method of preventing fuzzing by applying a predetermined ratio of coniferous trees and broad-leaved trees and starch to both sides (Patent Document 5), but there is no known document that clearly focuses on improving paper chip type Publicly-known literature disclosing the fuzz prevention performance of the electronic component storage strip and its effective solution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Paperboard for chip-type electronic component storage paper is manufactured by three-layer papermaking consisting of a surface layer, a middle layer, and a bottom layer with different pulp compositions. At this time, mix and dissolve 30% NBKP, 70% LBKP, and prepare 400ml of CSF (Canadian Standard Freeness) pulp for the surface layer; use 20% NBKP, 20% LBKP, and 20% fine old paper , 40% newspaper used paper ratio, prepare 350ml CSF pulp for the middle layer; prepare 400ml CSF pulp with 25% NBKP, 25% LBKP, 50% newspaper old paper ratio , for the bottom layer. Aluminum sulfate was added to each pulp slurry to adjust the pH to 6.0, and 0.3% of polyacrylamide (trademark: Polysteron 1250, manufactured by Arakawa Chemical Industries) was added as an internal paper strength enhancer. The pulp slurry of the above-mentioned conditions is combined in a rotary screen 3-layer papermaking machine, so that the surface layer is 100g / m 2 , middle layer 200g / m 2 , bottom layer 50g / m ...

Embodiment 2

[0053] It carried out similarly to Example 1, and manufactured the chip-type electronic component storage strip. However, on the surface of the surface layer, a coating layer containing a fuzz-preventing resin consisting of an olefin-maleic acid copolymer resin having a glass transition temperature of 60° C. (Trademark: PM482, manufactured by Arakawa Chemical Industry Co., Ltd.).

[0054] The measurement results are shown in Table 1.

Embodiment 3

[0056] It carried out similarly to Example 1, and manufactured the chip-type electronic component storage strip. However, 100 parts by mass of polyacrylamide (trademark: PS117, manufactured by Arakawa Chemical Industries) and 2.0 parts by mass of styrene-maleic acid copolymer resin (trademark: PM382, manufactured by Arakawa Chemical Industries) were mixed to prepare the surface of the surface layer. Treatment agent for fuzz prevention.

[0057] The measurement results are shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The invention relates to a paper band with several chambers for containing chip electronic elements. The invention is characterized in that: the surface of said band that closing the top sealing band of said chamber has a coat with fluff-prevent resin and selective soluble resin; said fluff-prevent resin contains at least one of phenylethene-maleic acid polymer resin, alkene-maleic acid polymer resin, acrylic ester-acrylic acid polymer resin and phenylethealkenene-alkene-acrylic polymer resin. Said inventive band has high adhesive strength, without fluff when removing the top sealing band.

Description

technical field [0001] The present invention relates to a paper-made chip-type electronic component storage strip, specifically, the present invention relates to a chip-type electronic component storage strip, which has excellent bonding strength with the top seal tape and can prevent the The strip is fluffed. Background technique [0002] The chip-type electronic component storage strip is a carrier (a material for storing and holding) of chip-type electronic components, and is usually produced by processing a cardboard as follows. [0003] (1) The strip is cut into strips having a predetermined width from a cardboard. [0004] (2) Corner holes and round holes of a predetermined size are formed in the obtained cardboard strip. The corner holes are used to accommodate chip-type electronic components, and the round holes are used to make the strip advance only a specified distance in the component filling machine. [0005] (3) Adhere the bottom sealing tape on the back sid...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02B65D65/38C09D125/08C09D123/08C09D133/08
CPCY02W90/10
Inventor 手岛伊久朗奥谷岳人山本学田平久美
Owner OJI PAPER CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com