Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Grinding recovery treatment technology of waste electron wiring board and its equipment

A technology of electronic circuit board recycling and treatment, which is applied in the direction of solid waste removal and process efficiency improvement, which can solve social and environmental pollution and other problems, and achieve the effects of no secondary pollution, long service life of equipment, and good separation effect

Inactive Publication Date: 2006-06-14
浙江丰利粉碎设备有限公司
View PDF0 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing treatment methods mainly include the following: the first is chemical treatment, which corrodes non-metals, and reacts copper metal into copper sulfate; the other is burning non-metals to extract metals. This method produces serious pollution to the social environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Grinding recovery treatment technology of waste electron wiring board and its equipment
  • Grinding recovery treatment technology of waste electron wiring board and its equipment
  • Grinding recovery treatment technology of waste electron wiring board and its equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] A waste electronic circuit board crushing and recycling process, which includes: the processed waste electronic circuit board is first broken into pieces smaller than 50×50mm by a powerful crusher, then enters a magnetic separator for iron removal, and then enters a secondary crusher for further crushing into granules smaller than 8-15mm, and the granules are sent to a fine pulverizer for crushing. Here, through crushing and dissociation, the metals are separated from the original attachment on the surface of non-metallic objects, and become the particle size. The mixed powder of metal powder and non-metal powder smaller than 0.4mm; the mixed powder is first separated by ultrafine classifier to remove 30-60% of the non-metal powder with a particle size of less than 0.1-0.15mm, and then enters the high-voltage electrostatic separator. The metal powder is collected; after the metal and non-metal are separated by the high-voltage electrostatic separator, the metal and non-m...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a worn-out electronic circuit plate mechanical disintegration and electrostatic separation recovery processing technique and its using equipment. The processing steps include the following steps: crushing worn-out electronic circuit plate; intermediate crushing after removing iron; fine crushing; dividing part nonmetal matter by ultra-micro classifier; sending to high voltage electrostatic separator to from finished product. The equipment includes brute force crusher, magnetic separator, intermediate crusher, fine crusher, ultra-micro classifier, and high voltage electrostatic separator. Its advantages are good crushing dissociation, good reclaiming effect, low energy consumption, long using life and no secondary pollution.

Description

1. Technical field [0001] The patent of the present invention relates to a method for mechanically crushing and recycling waste electronic circuit boards at normal temperature, specifically a method for recycling and processing metal and waste metal materials in waste electronic circuit boards through mechanical crushing and electrostatic separation . 2. Background technology [0002] Printed circuit boards (PCBs) are the foundation of the electronics industry. With the rapid development of the information industry, the production of printed circuit boards is increasing rapidly. The average annual growth rate of the world's printed circuit board industry is 8.7%, of which China's growth rate is 14.4%. By 1995, the total output value of my country's printed circuit boards had accounted for 50% of the world's total output value of printed circuit boards. At present, China has become a major producer and consumer of home appliances and electronic products. Since 2003, my coun...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C22B7/00B09B3/00
CPCY02P10/20
Inventor 余绍火
Owner 浙江丰利粉碎设备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products