Photocurable and thermosetting resin composition and printed circuit boards made by using the same

A resin composition, thermosetting technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of unqualified adhesion of conductor layers, no discovery, etc., to prevent degradation and achieve excellent operability Effect

Active Publication Date: 2006-01-04
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the heating process after the conductor layer is formed by electroless plating, electrolytic plating, etc., the volatile components generated by the interlayer insulating layer become an important factor for the failure of the conductor layer to adhere, and no solution has been found to completely solve this problem. question material

Method used

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  • Photocurable and thermosetting resin composition and printed circuit boards made by using the same
  • Photocurable and thermosetting resin composition and printed circuit boards made by using the same
  • Photocurable and thermosetting resin composition and printed circuit boards made by using the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0086] Synthesis example 1 (synthesis of carboxyl group-containing photosensitive resin)

[0087] In a three-necked flask with a thermometer, a stirrer, a dropping funnel and a reflux condenser, add 217g (1.0 equivalent) of cresol novolak type epoxy resin and 204.8g of carbitol acetate, wherein the epoxy resin is cyclo It has an oxygen equivalent of 217, has an average of 7 phenol core residues in one molecule, and has an epoxy group at the same time, and is heated and dissolved. After adding 0.2 g of hydroquinone as a polymerization inhibitor and 1.0 g of triphenylphosphine as a catalyst to this mixture, 72.0 g (1.0 equivalent) of acrylic acid was slowly added, and reacted at 85 to 105° C. for 16 hours. Then, 91.2 g (0.67 equivalent) of tetrahydrophthalic anhydride was subjected to addition reaction. The varnish thus obtained was a viscous liquid containing 35 parts of carbitol acetate, and was a carboxyl group-containing photosensitive resin having an acid value of 65 mgKOH...

Embodiment 1

[0088] Example 1 (composition in which component (B) is separated from component (A) and component (C))

[0089] In 100 parts of the carboxyl group-containing photosensitive resin obtained as (A) component obtained in Synthesis Example 1, 10 parts of dipentaerythritol hexaacrylate as (C) component, 1 part of antifoaming agent (Kyoeisha Oil Co., Ltd.) Manufacture: AC-300), 80 parts of barium sulfate and 0.5 parts of phthalocyanine green, compound and disperse with a three-roll mill, and use the composition thus obtained as component A, and in addition, compound 5 parts as component (B) R represented by the aforementioned (IV) 2A photopolymerization initiator having an oxime bond that is a methyl group, 1 part of diethylthioxanthone (manufactured by Nippon Kayaku Co., Ltd.: KAYUA-DETX-S) as component (B-I), 2.5 parts as (B-II) 4-Dimethylaminobenzoic acid ethyl ester (manufactured by Nippon Kayaku Co., Ltd.: Kayakyua-EPA) as the component, 20 parts of cresol novolak type epoxy r...

Embodiment 2

[0090] Example 2 (composition in which component B is separated from component A and component C)

[0091] Except not using diethylthioxanthone as the component (B-I) and ethyl 4-dimethylaminobenzoate as the component (B-II) in Example 1, according to exactly the same method as in Example 1, Formulations and methods to prepare A-parts and B-parts of photocurable and heat-curable resin compositions.

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Abstract

A photo- and thermo-setting resin composition comprising (A) a carboxyl-containing resin having at least one carboxyl group in the molecule, (B) a photopolymerization initiator having an oxime linkage represented by formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in the molecule, wherein the initiator (B) and a combination of the resin (A) and the diluent (C) are incorporated in different formulations respectively to form an at least two-part system.

Description

technical field [0001] The present invention relates to a photocurable and thermosetting resin composition and a printed circuit board using the composition. More specifically, it relates to excellent dryness to the touch, adhesion, and resolution, and less mist during heat curing. A photocurable and heat-curable resin composition excellent in storage stability at high sensitivity; and a product manufactured using the composition, which can reduce gas generated during component mounting, PCT (Pressure Cooker Test) resistance, electrical insulation, etc. Printed circuit boards with solder resist and / or resin insulation. Background technique [0002] Solder resist compositions are used to prevent solder bridging and protect circuits when components are soldered to printed circuit boards. Therefore, their cured products are required to have various properties such as adhesion, chemical resistance, and electrical properties. In recent years, in the manufacturing industry of pri...

Claims

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Application Information

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IPC IPC(8): C08G59/40C08G59/68C08L63/00C08L101/08G03F7/004G03F7/038H05K3/28
CPCG03F7/0045G03F7/038C08L101/08C08G59/686H05K3/287C08L63/00C08L2666/02C08G59/40C08G59/22
Inventor 小岛秀明平井良学米田直树峰岸昌司宫部英和
Owner TAIYO INK MFG
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