Substrate bonding method buried with Bragg reflector having high reflectivity
A Bragg reflector, high reflectivity technology, applied in the structure of optical resonator cavity, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problem of mirror surface roughness and cannot be directly bonded
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[0024] see Figure 1A ~ Figure 1E , this embodiment discloses a schematic diagram of a process for manufacturing a high-reflectivity substrate buried with a high-reflectivity Bragg reflector using the substrate bonding technology disclosed in the present invention. Its process steps include:
[0025] a) mask photolithography on the first substrate 100, etch out the groove 101, and keep the photoresist 150 ( Figure 1A middle);
[0026] b) growing a high-reflectivity Bragg mirror 102 in the trench 101 ( Figure 1B middle);
[0027] c) The Bragg reflector 151 and the photoresist 150 outside the trench 101 are stripped off by stripping with glue, and the reflector 102 in the trench is retained ( Figure 1C middle);
[0028] d) performing a chemical cleaning treatment on the first substrate 100 and the second substrate 110, and then bonding them together at room temperature for pre-bonding ( Figure 1D middle);
[0029] e) Carry out high temperature thermal annealing treatme...
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