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Sealed dust-proof temperature control cabinet for computers

A computer and chassis technology, which is applied in the field of sealed dustproof and temperature-controlled computer chassis, can solve problems such as burning out parts, affecting the stable operation of the whole machine, and offsetting subjective efforts

Inactive Publication Date: 2005-09-07
刘忠平
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] So far, people have adopted many measures to reduce the temperature inside the computer case, but most of them are based on passive methods such as accelerating the air replacement speed inside and outside the case. If the ambient temperature is already high, there is no way to speed up the air replacement speed inside and outside the case. How much effect, can not fundamentally solve the problem
Moreover, accelerating the air replacement speed inside and outside the case will bring another disadvantage that cannot be ignored: under the action of the heat dissipation fan of the power supply unit and the additional heat dissipation fan of some brands of cases, the case is actually a cavity that continuously maintains negative pressure, resulting in With the negative pressure effect of the case, a lot of fine dust enters from the outside of the case and accumulates on the components inside the case (although some cases are equipped with appropriate filters, the aperture of the filter mesh is not very small; and the case There are other installations and heat dissipation holes at the rear without any filtering measures), which will gradually cause the insulation performance of the exposed electrodes of each component to decline, and in severe cases, the circuit signal will be disordered, and even crash, burn out components, etc., seriously affecting the stable operation of the whole machine
If dust-proof measures are taken and filtration is strengthened, the speed of air replacement inside and outside the case will be reduced, thereby offsetting the subjective efforts to cool down the inside of the case

Method used

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  • Sealed dust-proof temperature control cabinet for computers
  • Sealed dust-proof temperature control cabinet for computers
  • Sealed dust-proof temperature control cabinet for computers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] figure 1 , figure 2 It is a schematic diagram of the method to realize this example. in, figure 1 It is a schematic diagram when the cooling plate is installed horizontally, figure 2 It is a schematic diagram when the cooling plate is installed vertically. The characteristic of this example is that the cold stack assembly is installed in the lower part of the chassis.

[0049] The chassis used in this example is based on the existing Lianzhi 8K commercial chassis in the market. In this example, two cold stacks are used in order to adapt to the chassis that requires greater cooling power (the purpose is to increase the power capacity of the cold stack, and the second is that under the same power capacity, the use of two cold stacks can be compared with the use of one cold stack. The effective heat dissipation area of ​​the hot end of the cold stack is doubled, which is not only conducive to the heat dissipation of the hot end of the cold stack, but also conducive ...

Embodiment 2

[0055] image 3 is the method to implement this example. This example also takes the existing Lianzhi 8K commercial chassis in the market as a reference object.

[0056] This example also uses two cold piles (the purpose and function are the same as in embodiment 1) to adapt to the chassis that requires greater cooling power. The hot end of the cold pile uses a larger volume aluminum alloy radiator to improve heat dissipation. Adapt to some chassis that require a large cooling capacity. In this example, the power supply and cold source components of the whole machine are placed on the upper part of the chassis structure. The hot end radiators share a heat dissipation air circulation channel. Under the action of the large-diameter fan M1, the heat dissipation air required for the power supply and the hot end of the cold stack enters from the front of the upper part of the chassis and flows to the rear of the chassis to heat the power supply and the cold stack. The heat gener...

Embodiment 3

[0059] The applicant found through the production practice of the dust-proof and temperature-controlled chassis prototype: when the cold stack is working, the heat generated by its hot end is very large. In the general application of low-power cold stacks, the solid radiator with traditional metal alloy material structure can meet its Basic heat dissipation requirements, and in the use of relatively high-power cold reactors, solid radiators with traditional metal alloy material structures often cannot meet the harsh heat dissipation conditions of cold reactors, and cooling devices with appropriate volume and higher efficiency must be used. Timely dissipate the large amount of heat generated by the cold stack, otherwise the cold stack will not be able to operate normally for a long time. Based on this, in order to make the cooling of the computer with a larger power cold stack continue to work stably, this example uses a liquid-cooled radiator with a built-in micro-liquid pump w...

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Abstract

This invention relates to a method for changing the unblocked cabinet adopted in traditional computer and its server into locked one to prevent harm dust does to computer, characterized in adopting present ceramic semiconductor refrigerator to supply cold source for blocked cabinet, temperature of cabinet used in computer and its server being controlled in the range of from 25Deg.C to 30Deg.C under the effect of controlling temperature circuit to make the computer and its server safely and stably work in clean environment and suitable temperature.

Description

technical field [0001] The invention relates to a method of changing the non-closed case used by traditional computers and computer servers into a closed case to avoid the harm of dust to the computer, and using the existing ceramic semiconductor cooling device (also known as "thermoelectric cooling component", hereinafter referred to as " "Cold stack") provides a cold source for the closed chassis to control the temperature inside the chassis, so that the computer and computer server can work stably at a suitable temperature. [0002] Attachments: 1. The web page of Taicang Refrigerator Factory in Jiangsu Province has two pages, "Principle of Refrigeration" and "Characteristics of Refrigeration". [0003] 2. One page of the main technical parameter table of TEC1-12605 thermoelectric cooling assembly. Background technique [0004] The applicant once filed an application for "Dustproof, Temperature Controlled, Defrosting Chassis for New Computers" (03117743.3) on April 23, 2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18G06F1/20
Inventor 刘忠平
Owner 刘忠平
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