Semiconductor device, semiconductor module and method of manufacturing semiconductor device

A semiconductor and device technology, applied in the field of semiconductor devices

Inactive Publication Date: 2005-03-09
RENESAS TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to directly connect electrodes provided on the lower surface of the underlying semiconductor chip with the lead frame

Method used

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  • Semiconductor device, semiconductor module and method of manufacturing semiconductor device
  • Semiconductor device, semiconductor module and method of manufacturing semiconductor device
  • Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Examples

Experimental program
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Effect test

Embodiment 1

[0065] Below, refer to Figure 1 to Figure 9 , the semiconductor device, the semiconductor module, and the manufacturing method of the semiconductor device in Embodiment 1 based on the first invention will be described.

[0066] Such as figure 1 As shown, the semiconductor module 101 of this embodiment is composed of a plurality of semiconductor devices 120a to 120d constituting a substrate and a plurality of electronic components 111a to 111c provided on the substrate to which the semiconductor devices 120a to 120d are connected.

[0067] In this embodiment, the electronic component 111 is constituted by a semiconductor package incorporating a semiconductor chip 112 . The electronic component 111 mounted on the substrate connecting the semiconductor devices 120a to 120d may be constituted by discrete elements such as resistors and capacitors in addition to such semiconductor packages.

[0068] In addition, the semiconductor packages constituting the electronic component 111...

Embodiment 2

[0091] Below, refer to the attached Figures 10 to 15 , the semiconductor device and its manufacturing method in Embodiment 2 based on the second invention will be described.

[0092] Such as Figure 10 As shown, the semiconductor device 202 of this embodiment has a plurality of semiconductor chips 203a to 203c, and the main surface of the semiconductor chip 203a is inclined to the main surfaces of the semiconductor chips 203b and 203c. The semiconductor device 202 is electrically connected to an insulating circuit substrate 211 as a base member. In addition, the semiconductor device 202 is sealed with a sealing material 221 to constitute a semiconductor device package 201 .

[0093] A plurality of electrodes 207 are provided on the lower surface of the insulating circuit substrate 211 . In addition, wiring 208 is provided at an appropriate position between electrodes 207 . In addition, a plurality of electronic components 261 connected to the electrodes 207 are arranged o...

Embodiment 3

[0117] Below, refer to Figure 16 , the semiconductor device in Embodiment 3 based on the third invention will be described.

[0118] Such as Figure 16 As shown, the semiconductor device 301 of this embodiment is equipped with: a substrate 311; a base member 321 whose first main surface is opposite to the substrate 311 and fixed on the substrate 311; and a semiconductor device fixed on the second main surface of the base member 321. Chip 331. A conductive material 322 penetrating from the first main surface to the second main surface of the base member 321 is provided in a portion of the base member 321 not overlapping the semiconductor chip 331 . The electrode 332 of the semiconductor chip 331 is electrically connected to the first main surface side of the conductive material 322 through the wiring 323 . The electrodes provided on the substrate 331 are connected to the second main surface side of the conductive material 322 .

[0119] The substrate 311 is constituted by ...

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PUM

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Abstract

A semiconductor device containing a semiconductor chip is provided with a coupling portion allowing coupling to a neighboring semiconductor device. The coupling portions couple the plurality of semiconductor devices to form a substrate, and a semiconductor package is arranged on the substrate via an electrode arranged on a surface of the substrate. This structure can improve a packaging density.

Description

technical field [0001] The invention relates to a semiconductor device, a semiconductor component and a method for manufacturing the semiconductor device. Background technique [0002] (Prior Art 1) [0003] Heretofore, semiconductor devices in which electronic components including a plurality of semiconductor chips are mounted on the surface of a circuit substrate are being used. In general, a base member of a predetermined shape is made of epoxy resin or the like, and wiring and the like are arranged to form a circuit board. A plurality of electronic components such as semiconductor packages and discrete components are arranged on one or both surfaces of the circuit board, and these electronic components are connected to electrodes on the circuit board. [0004] On the other hand, there is a semiconductor device described in Japanese Unexamined Patent Publication No. 10-335570 as a semiconductor device obtained by combining a plurality of semiconductor packages incorpora...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L23/12H01L23/31H01L23/495H01L23/498H01L23/52H01L23/538H01L25/10H01L25/11H01L31/0203
CPCH01L2225/1058H01L2924/00014H01L2924/3511H01L2224/16H01L2924/15311H01L23/3128H01L23/49833H01L2924/19041H01L23/4951H01L2224/48091H01L2224/32225H01L23/5387H01L24/48H01L24/45H01L2224/451H01L2224/48247H01L2224/45099H01L2924/01033H01L2224/32145H01L31/0203H01L2924/01078H01L2224/73257H01L2924/01082H01L23/3121H01L2224/4826H01L2924/01004H01L24/73H01L2924/01002H01L2225/1005H01L2224/73215H01L2924/01019H01L2225/1023H01L2924/01029H01L2924/014H01L2224/484H01L23/49575H01L2224/8592H01L2924/01047H01L2224/85399H01L25/105H01L23/5389H01L2224/48227H01L2924/01005H01L2924/01006H01L2224/05599H01L2924/01014H01L2924/01011H01L2224/73265H01L2924/3025H01L23/3157H01L2224/0401H01L2924/12042H01L2924/181H01L2224/16227H01L2924/15192H01L2924/19107H01L2924/1815H01L2924/00012H01L2224/32245H01L2924/00H01L2924/00015H01L23/52H01L23/12
Inventor 岩崎俊宽
Owner RENESAS TECH CORP
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