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Conductive paste and conductive film using it, plating method and production method for fine metal component

A conductive thin film, fine metal technology, used in semiconductor/solid-state device manufacturing, electrical components, conductive materials dispersed in non-conductive inorganic materials, etc., can solve through hole pattern deformation, mold damage, and fine metal components repeatability Reduce and other problems to achieve the effect of high conductivity

Inactive Publication Date: 2004-12-22
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0030] In each process, however, molds made of resin are likely to be damaged
In particular, the edge of the via pattern is rounded, or the sidewall of the via pattern is cut, so that the via pattern is likely to be deformed
Therefore, a new problem of reduced repeatability of the shape of fine metal components arises

Method used

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  • Conductive paste and conductive film using it, plating method and production method for fine metal component
  • Conductive paste and conductive film using it, plating method and production method for fine metal component
  • Conductive paste and conductive film using it, plating method and production method for fine metal component

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0247]

[0248] Titanium trichloride and sodium citrate were added to pure water to prepare a reducing agent solution, in which the concentrations of the two components adopted the values ​​shown in Table 1 below:

[0249] Table 1

[0250] Component Concentration (mol / L)

[0251] Titanium trichloride 0.102

[0252] Sodium citrate 0.306

[0253] Ammonia water is then added to the reducing agent solution to adjust the pH of the reducing agent solution to 9 to 10 while maintaining its liquid temperature at 35°C.

[0254] Further, nickel chloride hexahydrate was added to pure water to prepare a solution in which the concentration of nickel chloride was 0.04 mol / L.

[0255] After adding 100 ml of reducing agent solution to 100 ml of this solution, as described above, followed by stirring at a temperature of 35° C. for one hour, the solid components precipitated in the solution were filtered, rinsed, and then dried to produce Ni powder .

[0256] When th...

example 2

[0274]

[0275] Nickel chloride hexahydrate and ferric chloride were added to pure water to prepare a solution in which the concentrations of the two components adopted the values ​​shown in Table 2 below:

[0276] table 3

[0277] Component Concentration (mol / L)

[0278] Nickel chloride 0.008

[0279] Ferric chloride 0.032

[0280] To 100 ml of this solution was added 100 ml of the same reducing agent solution as used in Example 1, followed by stirring at 35° C. for one hour, and the solid component precipitated in the solution was filtered, rinsed, and then dried for Permalloy [Ni(20%)-Fe alloy] powder is produced.

[0281] When the shape of the obtained permalloy powder was observed with a scanning electron microscope, as Figure 9 As shown, it was confirmed that the permalloy powder had the form of fine metal particles connected in a chain shape.

[0282] When the diameter of each metal particle and the chain diameter of the permalloy p...

example 3

[0291]

[0292] The same conductive paste as prepared in Example 1 was applied to one surface of the polyimide film used as a substrate so that the amount of solid content attached was 20 mg / cm 2 , and then apply a magnetic field with a strength of 79 A / m to the coating film along its plane and bake it at 100° C. for four hours to remove the solvent, thereby forming a conductive film.

[0293] In this conductive thin film, the chain-like Ni powder is oriented in the above-mentioned direction of the magnetic field, and has high electrical conductivity only in the direction of its in-plane orientation. That is, the volume resistivity in the direction of the orientation of the chain Ni powder in the plane of the conductive film exhibits 5×10 -5 The low value of Ω·cm, while the volume resistivity in the direction perpendicular to the orientation direction in the same plane is 3×10 -3 Ω·cm, while the volume resistivity in the thickness direction of the conductive film is 2.5×10 ...

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Abstract

A conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure, and a method of producing a fine metal component having good characteristics. A conductive paste is such that metal powder in the form of many fine metal particles being linked in a chain form is blended. A conductive film is such that chain-form metal powder having paramagnetism is oriented in a constant direction by applying a magnetic field to a coating formed by the application of conductive paste. A plating method grows a plated coating by electroplating on a conductive film formed from a conductive paste. A method of producing a fine metal component which selectively grows a plated coating (4') on a conductive film (1) exposed at fine pass-hole pattern portions in a mold (3) to produce a fine metal component.

Description

technical field [0001] The invention relates to a new conductive glue, a conductive film formed by using the conductive glue, an electroplating method using the conductive glue, and a manufacturing method of fine metal elements using the electroplating method. Background technique [0002] In general, conductive adhesives have been widely used as materials for forming conductive films (conductive circuits of printed circuit boards, etc.), for conductive adhesion between electronic parts (fixation of devices or the like on conductive circuits, between conductive circuits connection, etc.) conductive adhesive, etc. [0003] The conductive paste is manufactured by mixing a powdery conductive component with a bonding agent such as resin and a solvent in a predetermined ratio. In addition, there is a conductive adhesive that uses a liquid adhesive such as a liquid curable resin and omits a solvent. [0004] Usually used as a conductive component is a metal powder having an aver...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/08C25D1/10C25D5/00C25D5/02H01L21/283H01L21/288H05K3/20H05K3/32
CPCH05K2201/035H05K3/202H01L21/283C25D1/08H05K3/205C25D1/10C25D5/022H01L21/2885H05K3/323H01B1/22
Inventor 依田润稻泽信二真嶋正利柏原秀树坂本敏宏年冈英昭
Owner SUMITOMO ELECTRIC IND LTD
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