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Process and apparatus for preparing porous metal by combined physical gas-phase deposition techinque

A physical vapor deposition, porous metal technology, applied in metal material coating process, electrical components, ion implantation plating, etc., to avoid heat accumulation, simplify the production process, and improve the effect of sponge aging

Inactive Publication Date: 2003-02-19
HUNAN CORUN NEW ENERGY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The technical problem to be solved by the present invention is: to solve the existing problems in the prior art of continuous conductive treatment of organic porous strip materials: such as, the electroless nickel plating method must drop into a large environmental protection cost, and the nickel foam contains a small amount of Phosphorus, coated with conductive adhesive method product uniformity is poor, higher carbon content, thicker and poorer pore size sponge conductive treatment effect, single PVD technology magnetron sputtering deposition rate is low, high cost, polyurethane sponge Easy aging, poor plating performance, large metal particles of single arc evaporation coating, uneven coating, easy to burn sponge, and the present invention aims to provide a method to overcome the above shortcomings of single technology, achieve uniform metal plating, and realize Method and equipment for producing porous metal by combined physical vapor deposition technology for double-sided continuous band-shaped sponge for conductive purpose

Method used

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  • Process and apparatus for preparing porous metal by combined physical gas-phase deposition techinque
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  • Process and apparatus for preparing porous metal by combined physical gas-phase deposition techinque

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Embodiment

[0040] see figure 1 , 1-rewinding (unwinding) volume chamber, 2-receiving (unwinding) volume roller, 3-measuring roller, 4-magnetic control coating chamber,

[0041] 5-Magnetic control target, 6-Arc evaporation chamber 7-Arc evaporation target, 8-Separator, 9-Cooling water jacket, 10-Pretreatment chamber, 11-Guide roller, 12-Unwinding (rewinding) volume chamber, 13- Put (close) roll roller.

[0042] The present invention combines evaporation plating, sputtering plating, and ion plating with one of the above-mentioned methods, such as the combination of arc evaporation plating and magnetron sputtering plating, and the combination of arc ion plating and magnetron sputtering plating to form a specific preparation. Methods and equipment. This type of PVD technology is called PVD combined technology because it is different from the single form of PVD technology commonly used. The present invention particularly relates to the technology of arc evaporation plating and magnetron sp...

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Abstract

A technology and apparatus for preparing porous metal by combined physical gas-phase deposition features that two of evaporating, sputtering and ion plating are combined in a coil-type vacuum coatingmachine. The said coil-type vacuum coating machine is composed of coiling-uncoiling reel and chamber, measuring roller, magnetically controlled plating chamber and its target, are evaporating chamberand its target, partition, cooling water jacket, etc.

Description

technical field [0001] The invention relates to a physical vapor deposition technology, in particular to a method and equipment for continuous conductive treatment of porous strips by adopting combined physical vapor deposition technology in the process of producing continuous strip-shaped porous metals. Background technique [0002] Generally, evaporation plating, sputtering plating, and ion plating under vacuum conditions are called physical vapor deposition (Physical Vapor Deposition) technology, referred to as PVD. Evaporation plating includes resistance heating evaporation plating, electron beam evaporation plating, laser evaporation plating, ion beam evaporation plating, induction evaporation plating, hollow cathode plasma electron beam evaporation plating, hot cathode plasma electron beam evaporation plating, arc evaporation plating, etc. Sputtering plating includes DC secondary sputtering plating, asymmetric AC sputtering plating, bias sputtering plating, tertiary sp...

Claims

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Application Information

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IPC IPC(8): C23C14/56H01M4/66H01M4/80H01M10/30
CPCH01M4/661H01M10/30H01M4/808C23C14/562Y02E60/10
Inventor 钟发平胡显奇陶维正盛钢汤义武梁汾生张灿中贺持缓谢红雨
Owner HUNAN CORUN NEW ENERGY CO LTD
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