Single-electron memory unit with nano metal oxide wire

Abstract

A milimicron metal oxide line single electron storage unit applies super-thin millimicron metal oxide line as the active region of the single electron storage unit, the thickness is 3nm, the width is one electron local length xi, and the length is 2-5 xi. An SiO2 isolated layer is between the active region and the up-layer writing line, the source line and data line are at both sides of the active region and SiO2 isolating layer, the writing line, data line and the source line are made of Au or Al metal films. Combined with MOSFET millicron, it can realize super-high density IC millicon storage memory of 10 to the power 12 bit, capable of working under room temp. with good stability, competitive with CMOS super large scale IC circuit.

Description

Technical field: [0001] The invention relates to a nanometer metal oxide wire single-electron storage unit, which is used in the technical field of nanometer electronics. Background technique: [0002] Due to the limitation of the principle structure, the traditional silicon MOS memory cannot be single in T Bit (10 12 Bit) play a leading role in ultra-high-density integrated nano-memory. This is because this memory uses a MOS transistor T (often called a gate) controlled by a word line and a capacitor C that stores digital information (0 or 1). S (often called storage capacitance), one of the most important technical indicators of this memory is the charge transfer rate T of the unit Q , in order to ensure correct detection of stored information, T Q Bigger is better, and T Q The size depends on the storage capacitor C S Parallel capacitance C B Ratio, the larger the ratio, the better. C B Limited by the overall design, the minimum is 10 -12 F level. Therefore, onl...

AI Technical Summary

Problems solved by technology

However, from the perspective of ultra-density integration requiring ultra-low power consumption and ultra-low voltage operation, the operating voltage of this single-electron memory is obviously too high

Moreover, although it is compatible with the classic silicon MOS process, it must be earlier than the production of metallized electrodes in terms of process flow procedures, which will bring disadvantages to the stability of single-electron memory performance, and the production process is relatively ,quite complicated

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