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Gold-silver alloy composite bonding wire and manufacturing method thereof

The technology of a gold-silver alloy and a manufacturing method, which is applied in the field of bonding wires, can solve the problems of high cost of bonding wires, low compressive strength, backward collecting devices and manufacturing processes, etc., and achieves less material consumption, cost saving, and good positioning. Effect

Pending Publication Date: 2022-08-09
江西蓝微电子科技有限公司
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  • Abstract
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Problems solved by technology

[0008] To this end, the present invention provides a gold-silver alloy composite bonding wire and a manufacturing method thereof, by changing the shape of the bonding wire from a cylindrical shape to a hexagonal prism, and at the same time improving the collection device and manufacturing process to solve the problem of traditional bond wires. The cost of threading is expensive, the tensile strength and compressive strength are low, and the collection device and manufacturing process are backward

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  • Gold-silver alloy composite bonding wire and manufacturing method thereof
  • Gold-silver alloy composite bonding wire and manufacturing method thereof
  • Gold-silver alloy composite bonding wire and manufacturing method thereof

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Embodiment Construction

[0059] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

[0060] Refer to the attached Figure 1-10 , the present invention provides a gold-silver alloy composite bonding wire and a manufacturing method thereof, comprising a bonding wire matrix and a surface composite coating, the bonding wire matrix is ​​a hexagonal prism, and the bonding wire matrix and the surface composite coating are composed of The overall shape is cylindrical, the outer diameter of the bonding wire substrate is 10-100 μm, and the thickness of the surface composite coating is 0.01-0.2 μm.

[0061] Further, the preparation method of the gold-silver alloy composite bonding wire comprises the following steps:

[0062] Step 1: melting and casting: the gold and silve...

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Abstract

The invention relates to the field of bonding wires for C and LED packaging, in particular to a gold-silver alloy composite bonding wire and a manufacturing method thereof.The gold-silver alloy composite bonding wire comprises a bonding wire base body and a surface composite coating, the bonding wire base body is in a hexagonal prism shape, and the overall shape formed by the bonding wire base body and the surface composite coating is cylindrical; the outer circle diameter of the bonding wire base body is 10-100 microns, and the thickness of the surface composite coating is 0.01-0.2 microns. According to the invention, the bonding wire is changed from a cylindrical shape to a hexagonal prism shape by changing the shape of the bonding wire, and meanwhile, a collecting device and a manufacturing process are improved, so that the problems that a traditional bonding wire is high in manufacturing cost and low in cost are solved. The tensile strength and the compression strength are low; and a collecting device and a manufacturing process are outdated.

Description

technical field [0001] The invention relates to the field of bonding wires for C and LED packaging, in particular to a gold-silver alloy composite bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (also known as bonding wire) is the main connection method for connecting chips and external packaging substrates (substrates) and / or multilayer circuit boards (PCBs). The development trend of bonding wire, from the product direction, is mainly the miniaturization of wire diameter, high floorlife and high spool length; from the chemical composition, there are mainly copper wires (including bare copper wire, palladium-plated copper wire, Flash gold palladium-plated copper wire) has largely replaced gold wire in the semiconductor field, while silver wire and silver alloy wire have replaced gold wire in LED and some IC packaging applications. Another important direction is the development of gold alloy wires to further reduce costs and mainta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22F1/14C22F1/02C21D9/52B65H54/40
CPCH01L23/49H01L21/4885C22F1/14C22F1/02C21D9/525B65H54/40
Inventor 彭庶瑶王佑任彭晓飞
Owner 江西蓝微电子科技有限公司
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